iXora provides the HRM‑4, a closed‑loop immersion cooling chassis that fits standard 19‑inch racks and submerges servers in dielectric fluid. The system cuts cooling power use by up to 50 % and includes a heat‑recovery loop that can feed district heating or other processes, while its modular, hot‑swappable design enables scalable, fan‑less operation for data centers and edge sites.
Funding
Funding not disclosed
Founders
Product
Problem
Data centers and server rooms rely on traditional air‑based cooling systems that consume large amounts of electricity, require extensive HVAC infrastructure, and generate waste heat that is discarded. This results in high operational costs, limited scalability for high‑density workloads, and missed opportunities for energy‑efficient heat reuse.
Solution
iXora offers the HRM‑4 (Hypotherm Rack Mount), a closed immersion cooling chassis that fits standard 19‑inch rack enclosures. By submerging equipment in a dielectric liquid, the system eliminates the need for air‑conditioning, fans, and large‑scale cooling plants, delivering up to 50 % reduction in energy consumption. The modular cassette design supports up to 4 kW per unit and provides hot‑swappable I/O modules for easy maintenance. Integrated heat‑recovery channels enable the captured thermal energy to be redirected to district heating or other on‑site processes, turning waste heat into a valuable resource. The solution is silent, plug‑and‑play, and scales from single cabinets to large edge deployments, allowing operators to upgrade cooling capacity without redesigning existing rack infrastructure.
Target Audience
Primary customers are data center operators, edge‑computing facilities, and enterprise IT teams that require high‑density, energy‑efficient cooling for servers and GPU workloads.
Features
- Closed immersion cooling cassette rated for 4 kW, compatible with any 19‑inch rack chassis
- Hot‑swappable I/O modules for rapid component replacement without downtime
- Fully modular, stackable architecture enabling incremental capacity expansion
- Silent operation with no fans or moving parts, reducing acoustic and mechanical wear
- Up to 50 % reduction in power usage compared to conventional air‑cooling systems
- Integrated heat‑recovery loop for district heating, greenhouse warming, or industrial processes
- Plug‑and‑play installation that leverages existing rack power and networking layouts
- Designed for edge and remote sites, supporting high‑density CPUs and GPUs in compact footprints