InZiv provides high-throughput inspection and metrology tools specifically designed for microLED and OLEDoS displays, utilizing electroluminescent technology for non-damaging, full wafer inspections. Their solutions enable manufacturers to achieve precise defect detection and quality assurance, addressing the critical need for reliable testing in the rapidly evolving display industry.
Funding
$12.5M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
MicroLED display manufacturing suffers from low yields and high costs due to the difficulty of identifying defective microLEDs early in the production process. Traditional electroluminescence (EL) inspection methods are often too slow, damaging, or lack the precision needed for efficient, high-volume testing. This makes it challenging to scale microLED production and achieve commercially viable displays.
Solution
InZiv provides high-throughput inspection and metrology solutions designed specifically for microLED and OLEDoS display manufacturing. Their core technology, R-EL™, enables rapid, non-destructive, full-wafer EL inspection, testing millions of LEDs per hour. By providing comprehensive optical and electrical data for each microLED, InZiv's tools allow manufacturers to make informed decisions, improve yields, and reduce costs. The solutions facilitate the transition of next-generation displays from R&D to mass production by addressing critical bottlenecks in microLED quality control.
Target Audience
InZiv's primary customers include microLED and OLEDoS display manufacturers, wafer firms, and large electronics companies involved in developing and producing advanced display technologies.
Features
- High-throughput R-EL™ technology enabling inspection of up to 6 million LEDs per hour
- Non-damaging contact probe cards, validated by atomic force microscopy
- Comprehensive analysis of go/no-go, intensity, wavelength, IV, Vf, and Ir parameters
- AI-powered algorithms for robust defect detection and data analysis
- OmniPix 3.0 system for high-resolution characterization and defect review
- Support for both flip-chip and vertical-chip microLED designs
- Capability to measure electrical and optical performance of microLED dies down to 1 micron