Insenso designs and manufactures MEMS‑based pressure sensing dies, calibrated sensor modules, and rugged transmitters that combine in‑house silicon design, micro‑fabrication, and turnkey packaging. The products deliver sub‑millimeter footprints, high accuracy, temperature compensation, and welded ports for aggressive media, enabling OEMs in industrial, automotive, medical, and scientific equipment to integrate precise pressure measurement without extensive redesign.
Funding
Funding not disclosed
Founders
Product
Problem
Accurate pressure measurement in industrial, automotive, medical, and scientific equipment often relies on bulky, off‑the‑shelf sensors that lack the precision, temperature stability, or form‑factor required for modern applications. Customization is limited, and integrating these sensors into harsh environments can be costly and time‑consuming. Consequently, system designers face trade‑offs between performance, size, and reliability.
Solution
Insenso delivers fully integrated MEMS‑based pressure sensing solutions that combine in‑house silicon die design, advanced micro‑fabrication, and turnkey packaging. By controlling the entire value chain—from wafer processing and die‑level testing to module assembly and final calibration—Insenso provides compact, high‑accuracy pressure dies, calibrated sensor modules, and rugged transmitters tailored to specific pressure ranges and media. The portfolio includes ultra‑miniature dies (e.g., 0.48 mm × 0.48 mm IPD53), low‑hysteresis modules (IPM10 series) with analog or digital outputs, and configurable transmitters (IPT10) that support absolute, gauge, or differential measurement. All products feature temperature compensation, welded pressure ports for aggressive fluids, and compliance with industry standards, enabling OEMs to integrate precise pressure sensing without extensive redesign or third‑party qualification.
Target Audience
Primary customers are OEMs and system integrators developing industrial automation, process‑control, automotive, medical‑device, energy‑utility, and scientific‑instrumentation hardware that require high‑precision, compact pressure sensing.
Features
- Piezo‑resistive MEMS pressure dies fabricated with 3D micro‑structuring, anodic and silicon direct bonding, and precision dicing for sub‑millimeter footprints.
- Fully automated die pick‑and‑place, wire bonding, and die‑on‑board (DOC) assembly lines delivering consistent high‑volume production.
- Calibrated sensor modules (IPM series) offering analog Wheatstone‑bridge or digital I²C/SPi outputs, built‑in PT1000 temperature compensation, and selectable pressure ranges from 40 mbar to 40 bar.
- Rugged pressure transmitters (IPT series) with oil‑filled or thin‑film piezoresistive cells, all‑welded ports for corrosive media, and configurable electrical interfaces (4‑20 mA, HART, Modbus).
- Comprehensive test regime including burst pressure, helium leak detection, temperature cycling, and long‑term drift characterization to ensure >0.25 % FS stability.
- Modular design files and API support for seamless integration into OEM PCB layouts and system‑level diagnostics.
- CE‑marked, ISO‑9001 certified production facilities in Europe and China, providing traceable quality control and rapid design‑to‑production cycles.