Inpria supplies metal‑oxide EUV photoresists built from tin‑oxide organometallic clusters that deliver superior EUV photon absorption and eliminate acid‑diffusion chemistry, enabling higher resolution and lower line‑width roughness for sub‑10 nm nodes. The homogeneous, low‑component formulation provides exceptional etch selectivity and simplifies manufacturing flows, and the company offers a complete material suite—including developers and ancillary chemicals—produced in a statistically controlled facility for seamless integration into semiconductor fab lines.
Funding
$31M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
5OJFounders
Product
Problem
Conventional chemically amplified EUV photoresists suffer from limited photon absorption, acid diffusion, and relatively large polymer structures, which constrain resolution, increase line‑width roughness, and complicate manufacturing flows for advanced semiconductor nodes.
Solution
Inpria supplies metal‑oxide EUV photoresists built from tin‑oxide organometallic clusters that are orders of magnitude smaller than traditional polymer chains. The high atomic‑level EUV absorption reduces photon shot noise, while the absence of acid‑diffusion mechanisms improves patterning resolution and line‑width uniformity. The homogeneous, low‑component formulation enhances etch selectivity, enabling simpler process stacks and supporting novel chip architectures. Inpria manufactures these resists in a dedicated, statistically controlled facility and offers a complete material suite—including developers and ancillary chemicals—to integrate seamlessly into existing lithography lines.
Target Audience
Primary customers are semiconductor manufacturers and fab lines developing sub‑10 nm technology nodes that require high‑resolution, low‑noise EUV lithography materials.
Features
- Tin‑oxide core organometallic clusters provide superior EUV photon capture and reduced shot noise
- No acid‑diffusion chemistry, delivering higher resolution and lower line‑width roughness
- Small, homogeneous building blocks improve material uniformity and device yield
- Exceptional etch selectivity compared with organic resists, allowing streamlined process flows
- Full product portfolio with compatible developers and ancillary materials for end‑to‑end integration
- Manufacturing in a statistically controlled plant with integrated quality management and SPC