Infraeo designs and manufactures high‑speed interconnect products—including active optical and copper cables, passive direct‑attach cables, and swappable transceiver modules—for Ethernet and InfiniBand data‑center and HPC applications. By co‑developing engineering designs with manufacturing processes, it delivers up to 10% lower power consumption, superior signal integrity, and a 3–5‑month concept‑to‑sample cycle, reducing cost and time‑to‑market for high‑bandwidth, low‑power networking solutions.
Funding
Funding not disclosed
Founders
Product
Problem
Data centers and high‑performance computing systems require increasingly fast interconnects, but traditional cable and transceiver solutions often suffer from high power consumption, limited signal integrity, long development cycles, and elevated costs, hindering scalability and efficiency.
Solution
Infraeo addresses these challenges by co‑developing engineering designs and manufacturing processes for a full portfolio of high‑speed interconnect products, including active optical cables, active copper cables, passive direct‑attach cables, and swappable transceiver modules. Their integrated approach optimizes optical coupling and signal conditioning, delivering up to 10 % lower power consumption compared with competing designs that use the same bill of materials. By leveraging partnerships with emerging technology developers and global commodity suppliers, Infraeo can bring new products from concept to sample in 3–5 months, reducing time‑to‑market. The resulting solutions provide superior signal integrity, lower cost, and flexible connectivity for Ethernet and InfiniBand standards ranging from 200 Gb/s to 1.6 Tb/s.
Target Audience
Infraeo’s primary customers are data‑center operators, cloud service providers, and OEMs of networking and high‑performance computing equipment that need high‑bandwidth, low‑power interconnect solutions for Ethernet and InfiniBand deployments.
Features
- Active optical cables with lightweight, long‑reach design and built‑in eye‑tracking for high‑density systems, offering excellent signal integrity and low power draw
- High‑speed transceiver modules (SFP, QSFP, OSFP, etc.) supporting NRZ and PAM4 modulation across 200 Gb/s to 1.6 Tb/s, with optional low‑power LPO and DSP/retimer options
- Active copper and retimer‑based electrical cables extending reach beyond traditional DAC limits up to 7 m while balancing performance and power efficiency
- Passive direct‑attach copper cables for ultra‑low‑latency, short‑distance links, optimized for power‑sensitive environments
- Integrated signal conditioning technologies (CDR, linear direct‑drive, DSP, retimer) and advanced optical sources (VCSEL, EML, SiPh PIC) to ensure compliance with Ethernet 802.3 and InfiniBand standards
- Rapid 3–5 month concept‑to‑sample cycle enabled by co‑development of design and manufacturing processes