Impact Cooling develops high-performance air heatsink technology utilizing patented jet impingement for server cooling. This drop-in solution significantly improves convective heat transfer, enabling the use of higher-powered CPUs, GPUs, and FPGAs. The system reduces airflow requirements and energy consumption while maintaining liquid cooling performance without the need for liquid infrastructure.
Funding
$100K raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Data centers face increasing energy consumption and operational costs due to the need for extensive cooling systems to manage the heat generated by high-powered chips. Traditional cooling methods, such as liquid cooling and air conditioning, are expensive, complex, and consume significant amounts of energy.
Solution
Impact Cooling offers a direct-to-chip air cooling solution that eliminates the need for liquid cooling or air conditioning, significantly reducing energy consumption in data centers. Their air heatsink technology leverages patented jet impingement to improve convective heat transfer, enabling the use of higher-powered chips while maintaining optimal server temperatures. The solution reduces airflow requirements by 50%, leading to potential energy savings at both the server and data center levels. It is designed as a drop-in replacement for traditional finned heatsinks and interfaces with existing server fans, simplifying integration and minimizing facility modifications.
Target Audience
The primary customers are data centers seeking to reduce energy consumption, lower operational costs, and unlock the potential of higher-powered chips without the complexity and expense of liquid cooling solutions.
Features
- Direct-to-chip air cooling solution that eliminates the need for liquids.
- Patented jet impingement technology improves convective heat transfer by 10x.
- Drop-in replacement design compatible with any XPU form factor (CPU, GPU, FPGA).
- Compatible with current server fans.
- Reduces airflow requirements by 50%.
- Maintains optimal server temperatures in ASHRAE 9.9 Class A4 environments.