Iceotope offers precision liquid cooling systems that directly cool all server components using a sealed chassis filled with a single‑phase dielectric fluid. The solution captures nearly all generated heat, enabling high inlet water temperatures, fan‑less operation, and up to 40% energy savings, making it suitable for high‑density AI workloads in data centers and edge deployments.
Funding
$107M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
AIBCBBBP+5Founders
Product
Problem
Data center air‑cooling cannot keep up with the rising power density of AI and high‑performance workloads, leading to hot spots, thermal stress, reduced hardware lifespan, high energy consumption, and the need for costly facility upgrades.
Solution
Iceotope provides Precision Liquid Cooling that directly cools every server component—CPU, GPU, memory, storage, and power supplies—using a sealed chassis filled with a single‑phase dielectric coolant. The coolant captures nearly all generated heat and transfers it to a rack‑level cooling loop, allowing operation at high inlet water temperatures and enabling dry‑cooler heat rejection. This approach eliminates noisy fans, reduces energy use and water consumption, and supports higher compute densities while extending component lifetimes. The technology is delivered as turnkey rack solutions (KUL AI for data centers and KUL BOX for edge deployments) with full integration, support, and a service guarantee.
Target Audience
Primary customers are hyperscale data‑center operators, enterprise AI compute facilities, and edge deployments in manufacturing, health‑care, finance, telecom, and media that require high‑density, low‑latency GPU workloads with strict energy, noise, and reliability constraints.
Features
- Direct‑to‑everything cooling delivers almost 100 % heat capture from all server components in a sealed chassis.
- Uses environmentally safe single‑phase dielectric fluid, requiring 5–10× less fluid than immersion tanks and operating at 50‑55 °C coolant temperatures.
- Fan‑less design removes noise and mechanical failure points, providing near‑silent operation suitable for human‑occupied spaces.
- Integrated chassis and rack‑level cooling loops enable high inlet water temperatures (>55 °C) and optional dry‑cooler heat rejection, eliminating the need for chilled water.
- Reduces IT cooling energy by up to 40 % and water use by up to 100 %, lowering carbon emissions by up to 40 % per kW of IT load.
- Modular rack architecture (KUL AI) fits existing data‑center infrastructure; compact 24U KUL BOX delivers turnkey AI inferencing clusters without facility water or chillers.
- Comprehensive support package includes pre‑installed hardware, pipework, logistics, on‑site installation, training, and a 3‑year parts‑and‑labor service plan.