The company offers programmable FPGA solutions that deliver up to four times the computing performance of leading competitors while consuming less power and providing a price advantage. Its devices accelerate product development, enabling customers to bring hardware to market up to 75% faster.
Funding
Funding not disclosed
Founders
Product
Problem
Designers of high‑performance embedded systems often face a trade‑off between computing capability, power consumption, and cost when using conventional FPGAs, leading to longer development cycles and delayed product launches.
Solution
HyperX Logic provides programmable FPGA‑based SoC processors built on its proprietary HyperX Architecture and supported by the HyperX Studio development suite. These devices deliver up to four times the computational performance of leading competitive FPGAs while consuming up to 50 % less power and offering a 40 % price advantage. The integrated hardware‑software stack accelerates firmware development and verification, enabling customers to bring hardware to market up to 75 % faster. HyperX’s solutions target demanding applications such as space systems, electronic warfare, quantum‑AI networking, and secure device platforms, where size, weight, power, and cost (SWaP‑C) are critical. By combining high‑performance silicon with a software‑driven workflow, the company reduces design risk and shortens time‑to‑revenue.
Target Audience
Primary customers are system integrators and OEMs developing embedded processors for aerospace, defense, quantum‑AI networking, and electronic warfare platforms.
Features
- Proprietary HyperX Architecture delivering 4× higher compute density than mainstream FPGAs
- Integrated SoC design with built‑in hard IP blocks for low‑power, high‑throughput processing
- HyperX Studio toolchain offering RTL synthesis, simulation, and automated SWaP‑C optimization
- 50 % lower power consumption compared to leading FPGA competitors
- 40 % lower bill‑of‑materials cost, providing a clear price advantage
- Accelerated development flow that can reduce product launch timelines by up to 75 %
- Qualified for space‑grade and ruggedized applications with radiation‑tolerant options