HYFIX builds a U.S.-made semiconductor platform that combines positioning, communications, compute, and edge AI for autonomous drones, robots, and other machines. Its flagship H1 chip, smaller than a dime, offers quad‑frequency GNSS, dual‑antenna RTK, encrypted 2.4/5.8 GHz links, and ROS 2‑compatible onboard AI, enabling precise flight control, longer endurance, and faster time‑to‑market for commercial and defense applications.
Funding
Funding not disclosed
Founders
Product
Problem
Most autonomous drones and robots depend on multiple separate components for positioning, communication, compute, and AI, often sourced from foreign supply chains. This fragmented approach increases bill‑of‑materials cost, adds integration complexity, and creates security risks for commercial and defense applications.
Solution
HYFIX offers the H1 semiconductor chip, a U.S.-designed and manufactured platform that consolidates quad‑frequency GNSS, dual‑antenna heading, secure MIMO radios, and edge AI compatible with ROS 2 into a single package smaller than a dime. By providing integrated positioning, communications, and compute, the chip enables precise flight control, extended endurance, and reduced time‑to‑market for autonomous systems. The solution supports PX4 flight control, advanced PWM, auto‑calibration, and encrypted mesh networking, allowing manufacturers to build secure, scalable drones and robots with lower component counts and lower overall cost.
Target Audience
Primary customers are manufacturers of commercial and defense autonomous drones, ground robots, and other field‑deployed machines that require integrated, secure positioning and communication solutions.
Features
- Quad‑frequency, quad‑constellation GNSS with dual‑antenna heading and GEODNET RTK for centimeter‑level positioning
- Integrated 2.4 GHz/5.8 GHz MIMO radio with encrypted mesh communication and anti‑jam/spoof protection
- Dual 64‑bit processor cores and ROS 2 compatibility for on‑board AI, VSLAM/VIO/VOA processing
- PX4‑compatible flight‑control interface with advanced PWM channels and auto‑calibration
- Compact 17.9 mm (US dime) footprint integrating positioning, compute, and sensing in a single chip
- MIPI camera input support and onboard IMU for sensor fusion
- Designed and fabricated in the United States to ensure supply chain security