HyCom Core provides a silicon‑photonics optical module that replaces traditional transceivers with integrated electro‑optic modulators and WDM capability, delivering up to 10× higher data rates while reducing energy per bit by roughly 30×. The ultra‑compact, temperature‑tolerant design fits standard CFP/QSFP slots, allowing hyperscale cloud providers, AI‑accelerator manufacturers, and quantum‑computing vendors to increase bandwidth density without additional cooling infrastructure.
Funding
Funding not disclosed
Founders
Product
Problem
Current data‑center transceivers rely on bulky, temperature‑controlled optics that consume large amounts of power and occupy significant rack space. As AI workloads scale, existing optical links cannot deliver the required bandwidth without incurring prohibitive cooling and energy costs, limiting the efficiency and density of modern compute clusters.
Solution
HyCom Core’s xPU Connectivity Platform replaces conventional transceivers with a proprietary thick silicon‑photonics (Si‑Photonics) solution that integrates high‑performance electro‑optic waveguide modulators. By leveraging multi‑wavelength (WDM) modulation in an ultra‑compact chip, the platform delivers data rates up to ten times faster while reducing energy per bit by roughly thirtyfold. The design operates across a wide temperature range, including cryogenic conditions, enabling deployment in both hyperscale AI clusters and emerging quantum‑computing systems. The platform is delivered as a drop‑in optical module that connects to standard data‑center interconnect (DCI) infrastructure, allowing operators to upgrade bandwidth and efficiency without redesigning existing rack layouts.
Target Audience
Primary customers are hyperscale cloud providers, data‑center system integrators, and AI‑accelerator manufacturers seeking high‑density, energy‑efficient optical interconnects, as well as quantum‑computing hardware vendors requiring cryogenic‑compatible links.
Features
- Proprietary thick Si‑Photonics waveguide technology with integrated electro‑optic modulators for high‑speed, low‑loss signal generation
- Multi‑wavelength (WDM) modulation enabling parallel data streams on a single fiber, increasing aggregate throughput by up to 10×
- Ultra‑compact form factor that reduces rack footprint and eliminates the need for dedicated cooling hardware
- Power consumption reduced by ~30× compared to legacy transceivers, delivering a lower total‑of‑ownership cost
- Operates reliably from ambient to cryogenic temperatures, supporting both AI accelerator clusters and quantum‑computing platforms
- Standardized optical I/O (e.g., CFP, QSFP) with built‑in DSP and forward error correction for seamless integration into existing DCI ecosystems
- Secure, firmware‑updatable silicon photonic ASIC that supports future protocol upgrades without hardware replacement