HighLine Technology provides modular dispensing systems that use ultra‑fine nozzles (down to 10 µm) and high‑speed parallel print‑heads to apply solder paste, adhesives, and functional inks with high precision and low waste. The configurable hardware—including slot‑die kits, single‑ and multi‑nozzle units, and closed‑off integration modules—supports both mass production and R&D process development across photovoltaic, semiconductor, adhesive bonding, and thick‑film energy‑storage applications.
Funding
$2.6M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Manufacturers of photovoltaic cells, semiconductors, adhesives, and thick‑film components often face challenges achieving precise, high‑speed material deposition while maintaining consistency and low waste. Conventional dispensing equipment can be bulky, lack fine resolution, and require extensive manual setup, limiting productivity and scalability.
Solution
HighLine Technology offers modular dispensing solutions that combine ultra‑fine nozzles (down to 10 µm), high‑speed parallel print‑heads, and closed‑system designs to deliver accurate, repeatable material application. The systems are configurable for both mass production and R&D process development, allowing rapid integration of new paste formulations and automation workflows. By leveraging a network of paste manufacturers and automation experts, HighLine provides end‑to‑end support from nozzle design through process optimization, enabling customers to increase throughput, reduce material waste, and improve product performance.
Target Audience
Primary customers are manufacturers and R&D teams in the photovoltaic, semiconductor, adhesive bonding, and thick‑film energy storage sectors that require high‑precision, high‑throughput material dispensing.
Features
- Ultra‑fine nozzle options (<10 µm) for high‑resolution dispensing of solder paste, adhesives, and functional inks
- Parallel print‑head modules (Multi X) delivering printing speeds up to 2 m/s for large‑area applications
- Modular architecture (Slot Die KIT, Micra, Mono, Cuckoo integration unit) allowing easy reconfiguration and scaling
- Closed‑off dispensing system that minimizes contamination and material loss
- Integrated process development support, including paste formulation assistance and automation integration
- Compatibility with a wide range of applications: PV metallization, semiconductor assembly, screen‑printed adhesives, and thick‑film energy storage layers