HexSeed Technology is a carbon capture and utilisation startup that converts captured CO₂ into high‑value supermaterials, beginning with low‑carbon, lab‑grown industrial diamonds. By integrating CCU into existing manufacturing processes, it supplies diamonds for electronics, telecommunications, high‑power lasers, optics, and precision instrumentation, turning carbon waste into a premium raw material. The approach targets the growing demand for cost‑effective, high‑performance materials in power‑intensive data‑center and chip applications.
Funding
Funding not disclosed
Founders
Product
Problem
Data‑center and high‑performance computing chips are consuming increasing power, leading to higher heat generation that strains cooling systems, reduces device reliability, and raises operational costs. The growing demand for low‑carbon, high‑performance materials further limits sustainable manufacturing options.
Solution
HexSeed Technology captures carbon dioxide and converts it into low‑carbon, lab‑grown industrial diamonds using chemical vapor deposition (CVD). These diamonds are integrated directly onto gallium nitride (GaN) devices as heat‑spreading films, extracting thermal energy at the source and improving chip efficiency and reliability. By sourcing feedstock from captured CO₂, the process reduces the carbon footprint of diamond production and creates a circular material loop for advanced electronics. The resulting supermaterials meet performance‑driven demand in electronics, telecommunications, high‑power lasers, optics, and precision instrumentation while lowering overall system heat and emissions.
Target Audience
Primary customers are semiconductor manufacturers and device makers developing GaN‑based high‑power and high‑frequency components, as well as OEMs in telecommunications, laser systems, and precision instrumentation seeking low‑carbon, high‑performance thermal solutions.
Features
- CVD growth of high‑purity industrial diamond films directly on GaN devices for superior thermal management
- Utilization of captured CO₂ as the carbon feedstock, enabling a low‑carbon supply chain for diamond production
- Scalable integration with existing semiconductor manufacturing processes, requiring minimal process changes
- Diamond films provide high thermal conductivity, reducing hotspot formation and extending device lifetime
- Materials meet stringent performance specifications for electronics, telecom, laser, and precision optics applications