Halo Industries develops proprietary laser-based hardware for silicon carbide (SiC) wafering, achieving superior wafer-per-millimeter yield while minimizing material stress and kerf loss. The technology enhances manufacturing efficiency by reducing material, energy, and water consumption compared to traditional wafering methods.
Funding
$80M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
UIFounders
Product
Problem
Traditional silicon carbide (SiC) wafering methods result in high material stress and kerf loss, reducing the wafer-per-millimeter yield and increasing manufacturing costs. These methods also consume significant amounts of energy and water.
Solution
Halo Industries offers laser-based hardware and processing technology for SiC wafering that minimizes material stress and kerf loss, leading to a higher wafer-per-millimeter yield. The technology improves manufacturing efficiency by reducing the consumption of materials, energy, and water compared to conventional techniques. This approach results in higher quality wafers with decreased crystal stress and surface defects. Halo Industries is also developing laser-based wafering and processing technologies for silicon, sapphire, diamond, and other critical materials.
Target Audience
The primary customers are manufacturers of silicon carbide wafers and devices seeking to improve yield, reduce costs, and enhance wafer quality.
Features
- Proprietary laser-based hardware for SiC wafering
- Best-in-class wafer-per-millimeter yield
- Decreased crystal stress and surface defects
- Reduced material, energy, and water consumption