Great Lakes Semiconductor
Great Lakes Semiconductor (GLS) operates ChipForge™, an integrated innovation ecosystem combining Fab-as-a-Service (FaaS™), flexible prototype and low-volume wafer manufacturing, and advanced Fab Integrated Packaging and Test (FINPAT™). The platform accelerates the transition from innovation to commercial production of essential-node semiconductor technologies powering AI, advanced manufacturing, healthcare, transportation, and defense. GLS integrates applied research, engineering services, and workforce development with strategic partnerships to strengthen North America's semiconductor supply chain.
- Semiconductor
- Manufacturing / Industry 4.0
Funding
Founders
Founder details are not available yet.
Product
Problem
North America faces a critical shortage of domestic capacity for essential-node semiconductor technologies, those outside the smallest process nodes that power AI, advanced manufacturing, healthcare, transportation, and defense. This gap forces reliance on overseas fabrication, limiting innovation speed, supply chain resilience, and the ability to move devices from concept to commercial production efficiently.
Solution
Great Lakes Semiconductor (GLS) operates ChipForge™, an integrated innovation ecosystem that combines Fab-as-a-Service (FaaS™), flexible prototype and low-volume wafer manufacturing, and advanced Fab Integrated Packaging and Test (FINPAT™). This platform integrates manufacturing, packaging, applied research, engineering services, and workforce development within a single collaborative environment. GLS enables rapid transition from innovation to commercial production of essential-node devices. Strategic collaborations with industry, government, universities, and international partners strengthen the semiconductor supply chain and accelerate next-generation device development.
Target Audience
Primary customers include companies and institutions developing essential-node semiconductor technologies for AI, advanced manufacturing, healthcare, transportation, defense, and critical infrastructure, spanning startups, established manufacturers, and government research programs.
Features
- ChipForge™ facilities integrating FaaS™, prototype and low-volume manufacturing, and FINPAT™ in one ecosystem
- Fab-as-a-Service (FaaS™) model enabling flexible access to fabrication resources without full capital commitment
- Advanced Fab Integrated Packaging and Test (FINPAT™) for heterogeneous integration and device validation
- Applied research and engineering services supporting device commercialization
- Workforce development programs to build domestic semiconductor talent pipelines
- Strategic partnerships with global technology leaders including S2AI, NEITAS, Daikin of Japan, APES, and AltaScient