Funding
Funding not disclosed
Founders
Product
Problem
In high-frequency communication systems, signal loss and distortion can significantly degrade performance, limiting data transmission speeds and reliability. Existing materials often fail to maintain signal integrity, especially in demanding applications like 5G/6G and advanced electronics.
Solution
CIT Co., Ltd. addresses these challenges by manufacturing advanced materials that ensure signal integrity in high-frequency applications. Utilizing metal single crystals and Atomic Sputtering Epitaxy (ASE), CIT's technology minimizes signal loss and distortion. Their product portfolio includes low-dielectric Flexible Copper-Clad Laminates (FCCL), semiconductor glass substrates, and transparent antennas, all designed to enhance signal transmission accuracy and speed. CIT's ASE deposition technology enables the creation of high-quality copper thin films on various substrates, including PTFE, sapphire, and glass. These materials are suitable for applications in 5G/6G communication, virtual reality (VR), augmented reality (AR), autonomous driving, and the Internet of Things (IoT).
Target Audience
CIT's products target manufacturers of telecommunications equipment, advanced electronics, and semiconductor packaging, particularly those requiring high-performance materials for 5G/6G and beyond.
Features
- Low-dielectric FCCL for mmWave communication in 5G/6G bands, fabricated using ASE deposition on PTFE
- Semiconductor glass substrates enabling stable performance and precise nanometer-scale patterning
- Transparent antennas for smart transportation systems, supporting real-time traffic management and security
- Atomic Sputtering Epitaxy (ASE) technology for building up atoms layer by layer, based on the RF sputter method
- MASE technology for surface alignment of up to one trillion copper/silver atoms on sapphire/PI/PTFE
- Manufacturing processes that minimize electrical noise and physical vibration