Scaling integrated circuits to smaller nodes increasingly relies on advanced patterning techniques that demand specialized materials. Conventional photoresists and process chemicals are expensive and often lack the performance needed for low‑ketch, high‑resolution features, driving up fab costs and limiting throughput. Without cost‑effective, high‑performance materials, semiconductor manufacturers struggle to meet aggressive roadmap targets for density and power efficiency.
Funding
Funding not disclosed
Founders
Product
Problem
Scaling integrated circuits to smaller nodes increasingly relies on advanced patterning techniques that demand specialized materials. Conventional photoresists and process chemicals are expensive and often lack the performance needed for low‑ketch, high‑resolution features, driving up fab costs and limiting throughput. Without cost‑effective, high‑performance materials, semiconductor manufacturers struggle to meet aggressive roadmap targets for density and power efficiency.
Solution
Geminatio supplies a portfolio of engineered polymers and spin‑on materials designed to enable low‑cost IC shrink pathways. Their directed self‑assembly (DSA) chemistries provide sub‑10 nm line‑space control while reducing the number of lithography steps required. Complementary spin‑on dielectric (SOD) and underlayer formulations deliver low‑k dielectric constants, high etch selectivity, and minimal line‑edge roughness, making them compatible with both DUV and high‑NA EUV platforms. The company also offers infrastructure services, including custom formulation, pilot‑line integration, and process‑optimization consulting, to accelerate adoption in fab environments. All products are delivered with full material data sheets, reliability testing, and supply‑chain support to ensure seamless incorporation into existing manufacturing workflows.
Features
- Tailored DSA polymer blends with programmable block copolymer domains for precise pitch multiplication and defectivity below 0.1 %
- High‑performance spin‑on dielectric (SOD) films featuring dielectric constants <2.5, low moisture uptake, and excellent planarization for multi‑patterning stacks
- EUV‑compatible resist additives that enhance absorption contrast and improve line‑edge roughness without additional exposure steps
- Scalable, solvent‑free deposition processes (spin‑coat, spray‑coat) that integrate with standard fab equipment and reduce chemical waste
- Comprehensive material qualification kits, including metrology standards for CD control, overlay accuracy, and defect inspection
- Process‑integration consulting covering formulation tuning, bake‑profile optimization, and compatibility testing with existing lithography tools
- Secure, just‑in‑time logistics and inventory management to support high‑volume production while minimizing stock‑holding costs