Frore Systems has developed the AirJet® solid-state chip for active device cooling, which enhances thermal management by doubling heat removal efficiency in consumer devices. This technology addresses processor throttling, enabling faster performance in compact, silent, and lightweight designs while maintaining dust and water resistance.
Funding
$180M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
FI+1Founders
Product
Problem
Modern electronic devices face increasing thermal challenges as manufacturers strive to pack more performance into smaller form factors. Traditional cooling solutions like fans and heat sinks are often inadequate, leading to processor throttling, reduced performance, and limitations on device design. These legacy systems can be bulky, noisy, and prone to failure, hindering the development of thinner, lighter, and more robust devices.
Solution
Frore Systems offers AirJet, a solid-state active cooling chip designed to address the thermal management challenges in consumer and industrial electronics. AirJet utilizes a novel approach to remove heat from devices, enabling significant performance improvements while maintaining a compact and silent operation. This technology allows for the creation of devices that are faster, thinner, lighter, and more resistant to dust and water, overcoming the limitations of traditional cooling methods. By integrating AirJet, manufacturers can unlock the full potential of their processors and deliver enhanced user experiences.
Target Audience
The primary target audience includes manufacturers of consumer electronics such as notebooks, mini PCs, SSD accessories, tablets, smartphones, and handheld gaming devices, as well as industrial embedded systems requiring robust thermal management solutions.
Features
- Solid-state active cooling technology with no moving parts for enhanced reliability and durability
- Compact form factor enabling integration into ultra-thin and lightweight devices
- Silent operation, eliminating noise associated with traditional fan-based cooling solutions
- Improved thermal management, preventing processor throttling and maximizing performance
- Dustproof and waterproof design, enhancing device robustness in harsh environments
- AirJet Mini G2: Delivers 50% more heat removal compared to previous generations
- AirJet PAK series: Offers scalable cooling solutions for various device sizes and power requirements
- SnowGoose AirJet Development Kit: Facilitates easy integration and testing of AirJet technology