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FM

Fringe Metrology

Fringe Metrology provides large‑scale structured‑light metrology systems that capture full‑field surface data of objects up to 2.5 m in under two minutes with sub‑10 µm accuracy, without contacting the part.

Tucson, ArizonaFounded 20243200+ followers
Updated 2 months ago

Funding

Funding not disclosed

Funding rounds are not available yet.

Founders

Founder details are not available yet.

Product

Problem

Manufacturers of large and freeform optical or structural components lack fast, non‑contact metrology tools that can capture full‑field surface data with micron‑level accuracy, especially for parts up to several meters in size. Existing contact probes, CMMs, and laser trackers provide sparse sampling, require lengthy setups, and cannot handle varied surface reflectivity.

Solution

Fringe Metrology offers large‑scale structured‑light metrology systems that acquire complete surface maps of objects up to 2.5 m in under two minutes with sub‑10 µm accuracy. By combining photogrammetry, interferometry, and fringe‑projection techniques, the platform delivers hundreds of times higher sampling density than traditional methods without touching the part. A specialized Structured Light Autocollimator extends the technology to wafer‑scale work, delivering nanometer‑level slope, shape, and defect measurements in a single capture. The resulting high‑resolution data enable rapid quality‑control checks, process optimization, and root‑cause analysis across diverse manufacturing environments.

Target Audience

Primary customers are manufacturers of large optical, aerospace, and radio‑telescope components, as well as semiconductor and wafer‑fabrication facilities requiring high‑precision surface characterization.

Features

  • Structured‑light scanner capable of measuring surfaces up to 2.5 m with <10 µm accuracy and full‑field coverage in <2 minutes
  • Non‑contact operation suitable for specular, diffuse, or non‑specular surfaces
  • Sampling density orders of magnitude greater than CMMs or laser trackers, revealing fine surface features
  • Structured Light Autocollimator (SLA) provides nanometer‑level measurement of wafers, capturing slope, shape, and complex defects in one shot
  • Integrated software that fuses photogrammetry, interferometry, and fringe projection for robust, repeatable results
  • Export of calibrated point clouds and surface meshes for downstream analysis and CAD integration
This profile is AI-generated and may contain inaccuracies.