Dragonfly provides ultra‑thin, lightweight piezo audio transducers that deliver a flat frequency response from 60 Hz to 20 kHz, overcoming the bass limitations of conventional piezo speakers.
Funding
Funding not disclosed
Founders
Product
Problem
Conventional piezo speakers are unable to reproduce low frequencies below 400 Hz, resulting in weak or absent bass and limiting their use in applications that require full-range audio. Additionally, piezo materials are brittle, making devices prone to failure from drops, vibration, and environmental stress.
Solution
Dragonfly offers ultra‑thin, lightweight piezo audio transducers that deliver a flat frequency response from 60 Hz to 20 kHz, providing true full‑range sound in a form factor far smaller than traditional electrodynamic speakers. The transducers are fully encapsulated with proprietary protective layers, giving them crack‑resistance and reliability under mechanical shock, vibration, and harsh environmental conditions. Customization options allow designers to tailor output power and specific frequency ranges to match the needs of diverse hardware platforms. By combining advanced design‑of‑experiments (DOE) and numerical simulation with optimized composite piezo materials, Dragonfly achieves performance that surpasses conventional piezo and cone speakers while maintaining low power consumption.
Target Audience
Primary customers are device manufacturers and hardware designers developing compact audio or haptic solutions for consumer electronics, wearables, IoT devices, and automotive applications.
Features
- Flat frequency response spanning 60 Hz
- 20 kHz for true bass and high‑frequency reproduction
- Ultra‑thin, lightweight form factor suitable for space‑constrained devices
- Full encapsulation with protective layers for crack resistance and durability under drops, vibration, and environmental stress
- Customizable output power and selectable frequency range to fit specific application requirements
- Low power consumption compared to electrodynamic speakers, enabling efficient integration
- Patent‑pending design optimized through DOE and advanced numerical simulations