Ferric delivers integrated voltage regulators (IVRs) that embed ferromagnetic power inductors directly into the CMOS process, creating DC‑DC converters more than ten times smaller than traditional discrete‑inductor solutions. Their thin‑film magnetic technology provides >90% conversion efficiency, up to 5 A/mm² current density, and high‑frequency (>30 MHz) multi‑phase operation, reducing component count and board space for AI processors, data‑center modules, and compact consumer electronics.
Funding
Funding not disclosed
Founders
Product
Problem
Modern high‑performance computing systems and compact consumer devices require power delivery that is both highly efficient and extremely space‑saving. Conventional DC‑DC converters rely on discrete inductors and multiple components, leading to large footprints, higher losses, and complex board layouts, which limit scaling of AI processors, data‑center modules, and space‑constrained electronics.
Solution
Ferric provides integrated voltage regulators (IVRs) that embed ferromagnetic power inductors directly within the CMOS semiconductor process using proprietary thin‑film magnetic materials. This integration yields converters that are more than ten times smaller than traditional solutions while delivering up to 5 A/mm² current density and conversion efficiencies above 90 %. The technology supports multi‑phase, high‑frequency operation (>30 MHz) and offers configurable package options such as back‑side PCB attach, land‑side attach, substrate‑embedded, and die‑side attach. By eliminating discrete components, Ferric’s IVRs simplify power‑delivery network design, reduce component count by up to 74 %, and improve regulation speed and power integrity for AI hyperscalers, data‑center servers, and mobile electronics.
Target Audience
Primary customers are semiconductor manufacturers and system designers of AI processors, high‑performance computing platforms, data‑center power modules, and compact consumer electronics seeking ultra‑dense, efficient power management solutions.
Features
- CMOS‑integrated ferromagnetic power inductor technology eliminating bulky discrete inductors
- >10× reduction in converter footprint with 50‑70 % area savings
- Up to 5 A/mm² current density and >90 % conversion efficiency across multi‑phase designs
- High‑frequency operation (>30 MHz) enabling fast regulation and reduced conduction losses
- Flexible integration options (back‑side PCB, land‑side package, substrate‑embedded, die‑side attach)
- Scalable architecture allowing ganging of up to 64 devices for >10 kW power delivery
- 40+ patents underpinning the magnetic material and process innovations