This startup provides optical inspection systems that detect non-visual defects like metallic and organic contamination on semiconductor wafers, improving manufacturing yield. Their technology uses a non-destructive, contactless optical method to characterize surfaces, interfaces, thin films, and bulk material properties, identifying issues missed by traditional inline tools.
Funding
Funding not disclosed
Founders
Product
Problem
In semiconductor manufacturing, undetected non-visual defects like metallic and organic contamination, structural irregularities, and variations in critical dimensions can significantly reduce manufacturing yield and device reliability. Traditional inline inspection tools often fail to identify these subsurface and non-visual irregularities. This leads to undetected defects in starting materials, causing device failure and yield loss.
Solution
Femtometrix provides advanced process control through its patented Harmonic series metrology systems, enabling fabs to improve yield by detecting Non-Visual Defects (NVD) optically. The Harmonic series utilizes Optical Second Harmonic Generation (SHG), a non-destructive and contactless optical characterization method, to analyze surfaces, interfaces, thin films, and bulk material properties. This technology characterizes critical dimensions, stress/strain, layer thickness, electrically active impurities, structural defects, interface roughness, and trapped charge density, providing comprehensive measurements of global uniformity and localized defect detection. The resulting maps enable the detection of yield-killing non-uniformities that cannot be seen by other in-line tools.
Target Audience
The primary target audience includes semiconductor manufacturers in high-volume advanced fabs, pilot production, development, and research labs seeking to improve yield and increase fab profitability.
Features
- Non-destructive optical technique using Second Harmonic Generation (SHG) for surface and subsurface analysis
- High in-line throughput for rapid defect detection
- Characterization of critical dimensions, stress/strain, and layer thickness
- Detection of trace metal contamination, structural defects, and interface roughness
- Measurement of electrically active impurities and trapped charge density
- Applicable to both patterned and blanket wafers
- ISO Class 1 cleanroom mini-environment
- Configurable for 200 mm or 300 mm wafers with dual load port EFEM