Meta‑optics provides nanoscale‑engineered optical components that combine beam shaping and high dispersion on a single monolithic device, delivering 2–5× higher wavelength resolution than traditional Littrow gratings.
Funding
Funding not disclosed
Founders
Product
Problem
Conventional optical components such as Littrow gratings require multiple separate elements, precise alignment, and bulky mounts, which increase system size, cost, and sensitivity to vibration. This limits wavelength resolution and hampers compact, high‑performance beam shaping and dispersion control in many optical instruments.
Solution
Epsilonphoton creates nanoscale meta‑optics that integrate beam shaping and high angular dispersion into a single monolithic device. Their non‑Littrow gratings achieve 2–5× higher wavelength resolution than traditional Littrow designs while delivering engineered beam profiles. The all‑dielectric metasurfaces provide 90–100% efficiency across arbitrary incidence and deflection angles, with optional polarization control. Fabricated using semiconductor foundry processes, the components are produced at wafer scale with high yield and minimal lot‑to‑lot variation, eliminating the need for mounts and alignment hardware. This enables OEMs and original beam‑forming manufacturers to reduce system footprint, improve robustness under high optical power, and simplify integration into macroscopic optical systems.
Target Audience
Primary customers are OEMs and original beam‑forming manufacturers that need compact, high‑performance dispersion and beam‑shaping solutions for spectroscopy, laser systems, and imaging instruments.
Features
- Non‑Littrow metasurface gratings that combine high dispersion and custom beam shaping in a single element
- 2–5× improvement in wavelength resolution compared to conventional Littrow gratings
- Patent‑pending all‑dielectric designs delivering 90–100% optical efficiency at any incidence‑deflection angle
- Polarization‑sensitive or polarization‑insensitive operation selectable per application
- Wafer‑scale, foundry‑ready fabrication using clean‑room semiconductor processes for high yield and low variability
- Monolithic 3‑in‑1 (and scalable n‑in‑1) integration eliminates mounts, reduces alignment complexity, and improves vibration tolerance