Epitactic creates high‑index contrast photonic materials—including low‑loss waveguides, sub‑volt electro‑optic modulators, and nonlinear components—that can be deposited and patterned using standard CMOS fab processes. These materials enable semiconductor foundries and telecom equipment makers to build integrated photonic circuits for ultrahigh‑bandwidth data links, photonic computing, and quantum photonic devices, reducing power consumption and simplifying the transition from electronic to photonic integration.
Funding
Funding not disclosed
Founders
Product
Problem
Current electronic interconnects limit data transmission rates, computing speed, and energy efficiency, creating bottlenecks for high‑performance telecommunication, data‑center, and emerging quantum computing systems.
Solution
Epitactic develops advanced photonic materials that enable the transition from traditional integrated electronics to fully integrated photonic circuits. By engineering next‑generation optical waveguides, modulators, and nonlinear components, the company provides the foundational building blocks required for ultrahigh bandwidth data links, photonic processors, and quantum photonic devices. Their material platform is designed for scalable manufacturing and compatibility with existing semiconductor fabrication lines, allowing manufacturers to incorporate photonic functionality without extensive redesign of production processes. This approach reduces power consumption, increases data throughput, and opens new capabilities for photonic computing and quantum information processing.
Target Audience
Primary customers are semiconductor foundries, telecom equipment manufacturers, and research labs developing photonic processors or quantum photonic hardware.
Features
- Customizable high‑index contrast waveguide materials optimized for low loss at telecom and visible wavelengths
- Integrated electro‑optic modulators with sub‑volt drive and picosecond response times
- Nonlinear photonic components (e.g., χ² and χ³ materials) for on‑chip frequency conversion and quantum photon generation
- Process‑compatible deposition and patterning techniques that align with standard CMOS fab workflows
- Thermal‑stable material formulations supporting high‑power operation and dense photonic integration