EPIC Microsystems provides hybrid switched‑capacitor (HSC) power‑delivery modules that replace traditional inductors in server DC‑DC converters, delivering over 90 % efficiency and higher power density for AI accelerators. The low‑profile, drop‑in design integrates thermal‑management features to reduce heat and rack height, enabling hyperscale cloud providers and data‑center OEMs to pack more GPUs and high‑performance CPUs without redesigning power infrastructure.
Funding
Funding not disclosed
Founders
Product
Problem
AI data centers require increasingly dense power delivery to support high‑performance accelerators, but conventional inductor‑based DC‑DC converters add bulk, generate excess heat, and limit current density, creating thermal and space constraints in server racks.
Solution
EPIC Microsystems delivers compact power‑delivery modules built on a hybrid switched‑capacitor (HSC) architecture that replaces bulky inductors with optimized capacitor networks. The design achieves higher power density and efficiency while reducing heat generation, enabling tighter rack packaging. Modules are engineered for low profile (reduced z‑height) and high current density, facilitating the integration of next‑generation AI GPUs and accelerators. The solution includes integrated thermal management features that simplify cooling in dense rack environments. EPIC’s silicon‑proven converters are supplied as drop‑in components compatible with standard server power‑distribution layouts, allowing data‑center operators to increase performance per watt without redesigning existing infrastructure.
Target Audience
Primary customers are hyperscale cloud providers, data‑center operators, and OEMs that design AI‑focused server racks and require high‑density, efficient power delivery for accelerators and GPUs.
Features
- Hybrid switched‑capacitor topology delivering >90 % efficiency across typical AI workload power ranges
- Compact, low‑profile form factor that reduces rack height and supports high current density
- Integrated thermal‑management design minimizing hotspot formation and easing cooling system requirements
- Modular, drop‑in package compatible with standard server DC‑DC power rails and connector ecosystems
- Scalable architecture supporting a wide range of AI accelerators, GPUs, and high‑performance CPUs
- Silicon‑proven semiconductor process ensuring reliability and high‑volume manufacturability
- Built‑in protection and transient‑response optimization for stable operation under rapid load changes