The company provides integrated thermal‑management systems for high‑density electronics such as data‑center servers, AI accelerators, battery‑management units and power‑electronics. Its product line combines modular liquid‑cooling plates, air‑cooling heat sinks, heat‑pipe and vapor‑chamber assemblies, and includes CFD‑driven design and rapid prototyping to deliver customized, high‑efficiency cooling with short lead times. OEMs can select capacity, form factor and mounting interfaces without redesign, while the in‑house manufacturing ensures reliability and ISO‑9001 compliance.
Funding
Funding not disclosed
Founders
Product
Problem
Modern high‑density electronic systems—such as data‑center servers, AI accelerators, battery‑management units, and power‑electronics for renewable energy—generate significant heat that exceeds the capacity of conventional cooling methods, leading to reduced performance, shortened component life, and increased system downtime.
Solution
The company delivers end‑to‑end thermal‑management solutions that combine liquid‑cooling modules, air‑cooling assemblies, DC fans, heat‑pipe networks, and vapor‑chamber technologies into fully integrated, system‑level products. Their engineering team uses computational fluid dynamics (CFD) and finite‑element thermal analysis to optimize heat‑removal paths for each application, ensuring uniform temperature distribution and low thermal resistance. Modular designs enable OEMs to tailor cooling capacity, form factor, and mounting interfaces without extensive redesign. All components are manufactured in‑house with precision machining and advanced surface‑treatment processes, providing high reliability and compliance with industry standards. The company also offers rapid prototyping and short lead‑times—prototype units within 1–2 weeks and volume production within 2–4 weeks—to accelerate time‑to‑market for customers.
Target Audience
Primary customers are OEMs and system integrators in data‑center servers, high‑performance computing accelerators, energy‑storage and renewable‑energy power electronics, and telecommunications equipment who require high‑efficiency, reliable thermal solutions.
Features
- Liquid‑cooling modules featuring micro‑channel cold plates, integrated pumps, and sealed coolant loops for high heat‑flux removal (up to 500 W cm⁻²)
- Air‑cooling modules with high‑efficiency finned heat sinks, optimized airflow geometry, and low‑noise DC fans (up to 200 CFM)
- Customizable heat‑pipe and vapor‑chamber assemblies employing capillary‑wicked structures for two‑phase heat transfer in compact spaces
- Modular mechanical interfaces and standardized mounting kits that support quick integration into server racks, battery packs, and power‑electronics enclosures
- In‑house CFD‑driven thermal simulation service that validates designs and predicts performance across operating conditions
- Robust quality‑control pipeline including ISO‑9001 certification, automated inspection, and accelerated life‑testing to ensure long‑term reliability
- Scalable manufacturing capability across three production facilities, enabling batch sizes from low‑volume prototypes to high‑volume OEM orders