Ecoatoms designs and manufactures modular, radiation‑tolerant payload computers for space missions, offering the A.N.I.M.A. onboard platform that supports real‑time edge analytics across suborbital, orbital and lunar vehicles. The company provides end‑to‑end integration services—including mechanical, thermal, electrical design and software deployment—to deliver certified, low‑power payloads that can be updated remotely and scale from prototype to production.
Funding
Funding not disclosed
Founders
Product
Problem
Space missions require reliable, high‑performance payloads and onboard computing that can operate across a wide range of vehicle classes, from suborbital rockets to lunar landers. Existing solutions are often vehicle‑specific, bulky, or lack the processing power needed for real‑time edge analytics, limiting the ability of agencies and commercial customers to run complex experiments in space.
Solution
Ecoatoms delivers custom‑engineered space payloads combined with edge‑computing hardware that addresses these integration challenges. Its A.N.I.M.A. onboard computer is a modular, radiation‑tolerant platform designed to function on more than 20 different vehicle types, providing high‑throughput processing, low‑power operation, and real‑time data handling. The company offers end‑to‑end services—from mechanical and thermal design to electrical integration and software deployment—enabling customers to launch sophisticated experiments or commercial payloads without extensive redesign. By partnering with NASA and major commercial entities, Ecoatoms ensures compliance with aerospace standards and streamlines certification, reducing schedule risk for space missions.
Target Audience
Primary customers are government space agencies, commercial satellite operators, and large enterprises (including Fortune 500 firms) that need reliable, multi‑vehicle compatible payloads and onboard edge‑computing for scientific experiments, technology demonstrations, or commercial services in space.
Features
- A.N.I.M.A. onboard computer: radiation‑hardened processor, modular I/O (CAN, SpaceWire, Ethernet), and scalable memory for on‑board AI inference and data reduction
- Unified hardware architecture compatible with suborbital, orbital, and lunar vehicles, eliminating the need for multiple custom boards
- Integrated thermal management system with passive radiators and active heaters to maintain optimal operating temperatures across mission profiles
- Real‑time edge analytics stack that processes sensor data onboard, supports autonomous decision‑making, and downlinks only essential telemetry
- Remote software update capability via secure, encrypted links, allowing post‑launch firmware upgrades without physical access
- Full payload integration service: mechanical design, electrical harnessing, vibration and shock qualification, and compliance with NASA‑STD‑8739 and other aerospace standards
- Scalable manufacturing pipeline that supports low‑volume prototype runs and high‑volume production for commercial customers
- Secure data handling with end‑to‑end encryption and role‑based access controls for mission‑critical information