Ronnen Lovinger
CEO
DustPhotonics
DustPhotonics develops pluggable optical modules utilizing Low Loss Laser Coupling (L3C) technology to integrate off-the-shelf lasers on silicon, enabling high-speed data transmission at rates of 400Gb/s to 1.6Tb/s. This technology addresses the need for lower power consumption and reduced costs in data center and high-performance computing applications by minimizing the number of lasers required in the system.
- Hardware
- Semiconductor
Updated 7 months ago
Funding
Raised to date
$102MRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Funding rounds are not available yet.
Founders
Product
Problem
High-speed data transmission in data centers and high-performance computing environments requires efficient optical interconnects that minimize power consumption and cost while scaling to meet increasing bandwidth demands. Existing solutions often involve complex laser configurations, leading to higher costs and power usage.
Solution
DustPhotonics develops silicon photonics-based optical interconnect solutions, leveraging its Low Loss Laser Coupling (L3C) technology to integrate off-the-shelf lasers onto silicon photonics ICs. This approach reduces the number of lasers required, lowering bill of materials costs and improving assembly yields. The L3C technology enables lower loss and higher optical margins, resulting in improved performance and scalability for high-speed data transmission. DustPhotonics' silicon photonics platform offers a complete technology library, including active and passive components, laser integration, and fiber coupling, enabling end-to-end solutions for optical interconnects. Their product families, such as Carmel, Oz, and Tamar, support data rates from 400Gb/s to 1.6Tb/s and are designed for applications including DR4, DR8, LPO, LRO, and immersion cooling.
Target Audience
The primary target audience includes data centers, hyperscale data centers, and high-performance computing environments requiring high-speed, low-power optical interconnects.
Features
- Low Loss Laser Coupling (L3C) technology for efficient integration of off-the-shelf lasers on silicon
- Silicon Photonics ICs (PICs) for transmit functions with integrated lasers
- Product families supporting data rates from 400Gb/s to 1.6Tb/s, including Carmel, Oz, Tamar, and Kfir
- Support for various applications such as DR4, DR8, LPO, LRO, and immersion cooling
- Comprehensive silicon photonics platform with active and passive components, laser integration, and fiber coupling
- High-speed modulators and detectors supporting a broad range of wavelengths and high data rates
- Optical waveguides, splitters, combiners, and components for WDM designs
- Solutions optimized for Linear Pluggable Optics (LPO) and Linear Receive Optics (LRO)
- Compact footprint designs suitable for OSFP and other high-density modules