DustPhotonics

About DustPhotonics

DustPhotonics develops pluggable optical modules utilizing Low Loss Laser Coupling (L3C) technology to integrate off-the-shelf lasers on silicon, enabling high-speed data transmission at rates of 400Gb/s to 1.6Tb/s. This technology addresses the need for lower power consumption and reduced costs in data center and high-performance computing applications by minimizing the number of lasers required in the system.

```xml <problem> High-speed data transmission in data centers and high-performance computing environments requires efficient optical interconnects that minimize power consumption and cost while scaling to meet increasing bandwidth demands. Existing solutions often involve complex laser configurations, leading to higher costs and power usage. </problem> <solution> DustPhotonics develops silicon photonics-based optical interconnect solutions, leveraging its Low Loss Laser Coupling (L3C) technology to integrate off-the-shelf lasers onto silicon photonics ICs. This approach reduces the number of lasers required, lowering bill of materials costs and improving assembly yields. The L3C technology enables lower loss and higher optical margins, resulting in improved performance and scalability for high-speed data transmission. DustPhotonics' silicon photonics platform offers a complete technology library, including active and passive components, laser integration, and fiber coupling, enabling end-to-end solutions for optical interconnects. Their product families, such as Carmel, Oz, and Tamar, support data rates from 400Gb/s to 1.6Tb/s and are designed for applications including DR4, DR8, LPO, LRO, and immersion cooling. </solution> <features> - Low Loss Laser Coupling (L3C) technology for efficient integration of off-the-shelf lasers on silicon - Silicon Photonics ICs (PICs) for transmit functions with integrated lasers - Product families supporting data rates from 400Gb/s to 1.6Tb/s, including Carmel, Oz, Tamar, and Kfir - Support for various applications such as DR4, DR8, LPO, LRO, and immersion cooling - Comprehensive silicon photonics platform with active and passive components, laser integration, and fiber coupling - High-speed modulators and detectors supporting a broad range of wavelengths and high data rates - Optical waveguides, splitters, combiners, and components for WDM designs - Solutions optimized for Linear Pluggable Optics (LPO) and Linear Receive Optics (LRO) - Compact footprint designs suitable for OSFP and other high-density modules </features> <target_audience> The primary target audience includes data centers, hyperscale data centers, and high-performance computing environments requiring high-speed, low-power optical interconnects. </target_audience> ```

What does DustPhotonics do?

DustPhotonics develops pluggable optical modules utilizing Low Loss Laser Coupling (L3C) technology to integrate off-the-shelf lasers on silicon, enabling high-speed data transmission at rates of 400Gb/s to 1.6Tb/s. This technology addresses the need for lower power consumption and reduced costs in data center and high-performance computing applications by minimizing the number of lasers required in the system.

Where is DustPhotonics located?

DustPhotonics is based in Modi‘in Makkabbim Re‘ut, Israel.

When was DustPhotonics founded?

DustPhotonics was founded in 2017.

How much funding has DustPhotonics raised?

DustPhotonics has raised 102000000.

Location
Modi‘in Makkabbim Re‘ut, Israel
Founded
2017
Funding
102000000
Employees
64 employees

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DustPhotonics

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Executive Summary

DustPhotonics develops pluggable optical modules utilizing Low Loss Laser Coupling (L3C) technology to integrate off-the-shelf lasers on silicon, enabling high-speed data transmission at rates of 400Gb/s to 1.6Tb/s. This technology addresses the need for lower power consumption and reduced costs in data center and high-performance computing applications by minimizing the number of lasers required in the system.

dustphotonics.com5K+
cb
Crunchbase
Founded 2017Modi‘in Makkabbim Re‘ut, Israel

Funding

$

Estimated Funding

$100M+

Team (50+)

No team information available.

Company Description

Problem

High-speed data transmission in data centers and high-performance computing environments requires efficient optical interconnects that minimize power consumption and cost while scaling to meet increasing bandwidth demands. Existing solutions often involve complex laser configurations, leading to higher costs and power usage.

Solution

DustPhotonics develops silicon photonics-based optical interconnect solutions, leveraging its Low Loss Laser Coupling (L3C) technology to integrate off-the-shelf lasers onto silicon photonics ICs. This approach reduces the number of lasers required, lowering bill of materials costs and improving assembly yields. The L3C technology enables lower loss and higher optical margins, resulting in improved performance and scalability for high-speed data transmission. DustPhotonics' silicon photonics platform offers a complete technology library, including active and passive components, laser integration, and fiber coupling, enabling end-to-end solutions for optical interconnects. Their product families, such as Carmel, Oz, and Tamar, support data rates from 400Gb/s to 1.6Tb/s and are designed for applications including DR4, DR8, LPO, LRO, and immersion cooling.

Features

Low Loss Laser Coupling (L3C) technology for efficient integration of off-the-shelf lasers on silicon

Silicon Photonics ICs (PICs) for transmit functions with integrated lasers

Product families supporting data rates from 400Gb/s to 1.6Tb/s, including Carmel, Oz, Tamar, and Kfir

Support for various applications such as DR4, DR8, LPO, LRO, and immersion cooling

Comprehensive silicon photonics platform with active and passive components, laser integration, and fiber coupling

High-speed modulators and detectors supporting a broad range of wavelengths and high data rates

Optical waveguides, splitters, combiners, and components for WDM designs

Solutions optimized for Linear Pluggable Optics (LPO) and Linear Receive Optics (LRO)

Compact footprint designs suitable for OSFP and other high-density modules

Target Audience

The primary target audience includes data centers, hyperscale data centers, and high-performance computing environments requiring high-speed, low-power optical interconnects.

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