Diasense
Diasense provides a quantum‑diamond magnetic microscope that captures magnetic field patterns from current flow inside integrated circuits, enabling fully contactless, non‑destructive failure analysis and production monitoring. The system combines micron‑scale spatial resolution, high magnetic sensitivity, and fast imaging to reveal buried interconnect defects and power‑distribution anomalies that traditional techniques miss, helping semiconductor manufacturers accelerate root‑cause identification and improve yield.
- Hardware
- Manufacturing / Industry 4.0
- Quantum Computing
- Semiconductor
Funding
Raised to date
$541.9KRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Semiconductor manufacturers often rely on invasive, low‑throughput techniques to locate defects in integrated circuits, making root‑cause analysis slow, costly, and sometimes unable to detect buried or subtle failure mechanisms.
Solution
Diasense offers a quantum‑diamond magnetic microscope that captures magnetic field patterns generated by current flow inside chips without physical contact. By leveraging quantum sensing, the system provides high magnetic sensitivity combined with micron‑scale spatial resolution and rapid imaging speed. This enables non‑destructive failure analysis and in‑line production monitoring, revealing interconnect issues, power‑distribution anomalies, and other hidden defects that traditional methods miss. The technology accelerates root‑cause identification, reduces iteration cycles, and helps improve yield and reliability of semiconductor products.
Target Audience
Primary customers are semiconductor design houses, fabs, and test/validation labs that require precise, non‑invasive diagnostics for chip failure analysis and in‑line production monitoring.
Features
- Quantum diamond sensor delivering unprecedented magnetic field sensitivity at the microscale
- Micron‑level spatial resolution for imaging current flow in buried circuit structures
- High‑throughput, fast imaging suitable for both failure analysis and production monitoring
- Fully contactless, non‑destructive inspection preserving device integrity
- Ability to detect subtle interconnect defects and power distribution variations
- Integrated data processing for rapid fingerprinting of process variations