Dianxin Technology manufactures microLED and chiplet process measurement equipment that utilizes AI algorithms and advanced optical technologies for precise 2D and 3D defect detection. This technology addresses the critical challenge of yield management in semiconductor packaging by ensuring comprehensive inspection at every production stage.
Funding
Funding not disclosed
Founders
Product
Problem
Advanced packaging methods like Chiplet and MicroLED technologies face significant yield challenges due to increasing chip and connection densities. Traditional inspection methods often lack the precision and speed required for comprehensive defect detection at each production stage, leading to inefficiencies and potential quality issues.
Solution
Dianxin Technology provides AI-powered metrology equipment for 2D and 3D defect detection in microLED and chiplet processes. Their systems employ advanced optical technologies and AI algorithms to perform comprehensive inspections at critical points in the production line. This enables real-time yield monitoring and management, helping manufacturers identify and address defects early in the process. Dianxin's solutions also include AI algorithms that can be integrated with existing AOI equipment to enhance their capabilities and reduce the need for manual review.
Target Audience
The primary customers are manufacturers of microLED displays and advanced packaging solutions, including those utilizing Chiplet technology, who require precise and efficient defect detection for yield management.
Features
- AI-powered algorithms for defect detection and classification
- 2D and 3D metrology capabilities for comprehensive inspection
- Solutions for microbump, RDL, and MicroLED defect detection
- Equipment for wafer-level packaging and large panel inspection
- Algorithms compatible with existing AOI equipment
- High-resolution imaging using advanced optical technologies