Cryochips provides wafer‑scale solid‑state quantum refrigerators that cool from 40 K to millikelvin temperatures using multi‑stage tunnel‑junction refrigeration, eliminating the need for helium‑3 dilution systems. The compact, no‑moving‑part chips integrate directly with superconducting, trapped‑ion, neutral‑atom, and photonic qubit platforms, enabling scalable, low‑volume cryogenic cooling for quantum hardware developers.
Funding
Funding not disclosed
Founders
Product
Problem
Quantum computers require millikelvin temperatures, which are currently achieved with large, complex dilution refrigerators that depend on scarce helium‑3 isotopes and occupy substantial laboratory space. This makes scaling quantum systems difficult and limits the deployment of fault‑tolerant architectures.
Solution
Cryochips offers wafer‑scale solid‑state quantum refrigerators, called Śūnya chips, that achieve cooling from 40 K down to millikelvin temperatures using multi‑stage tunnel‑junction refrigeration. The chips integrate discrete solid‑state cooling stages (40 K → 4 K → mK) on standard 150‑300 mm semiconductor wafers, eliminating the need for fluidic helium systems and moving parts. By collapsing the volume of traditional dilution plants from >100 m³ to <10⁻⁵ m³, the technology enables compact, modular cooling that can be directly integrated with various quantum computing platforms. The solid‑state approach also improves coefficient of performance and reduces thermal interstage losses, supporting higher qubit coherence and fault‑tolerant operation.
Target Audience
Primary customers are quantum hardware developers and system integrators building superconducting, trapped‑ion, neutral‑atom, or photonic quantum computers who need scalable, low‑volume cryogenic cooling for fault‑tolerant operation.
Features
- Multi‑stage tunnel‑junction refrigeration delivering temperature steps of 40 K, 4 K, and millikelvin on a single wafer
- Wafer‑scale fabrication compatible with 150‑300 mm semiconductor manufacturing processes
- No moving parts or fluidic helium handling, removing dependence on helium‑3 isotopes
- Integrated design eliminates interstage substrates, maximizing coefficient of performance and minimizing temperature drops
- Compact form factor (<10⁻⁵ m³) reduces cryogenic plant size by over 10 million‑fold compared to conventional dilution refrigerators
- Compatibility with superconducting, trapped‑ion, neutral‑atom, and photonic qubit architectures
- Modular integration workflow supporting requirement definition, thermal modeling, validation, and deployment into production quantum systems