Corticale develops minimally invasive CMOS‑based neural implants that record from up to 1024 electrodes per probe, delivering single‑cell resolution across broad brain regions. Their modular SiNAPS technology enables simultaneous acquisition of action potentials and local field potentials from hundreds of neurons for high‑definition brain‑computer interface applications. The platform is designed for long‑term stability and scalability in research and clinical neurotechnology settings.
Funding
Funding not disclosed
Founders
Product
Problem
Existing neural interfaces often lack the resolution and scalability needed to effectively monitor and modulate brain activity at the single-cell level across large neural networks. Traditional devices can be invasive and lack long-term stability, limiting their applicability for chronic neurological conditions and advanced brain-computer interfaces.
Solution
Corticale develops high-density CMOS-based neuroelectronic devices designed for minimally invasive interfacing with neural tissue. Their SiNAPS technology features neural probes with up to 1024 independent recording electrodes, spaced 30 micrometers apart, enabling high-resolution acquisition of bioelectrical brain activity at the single-cell level. The modular design allows for simultaneous recording from numerous neural cells throughout the brain tissue, not just the surface. These compact, energy-efficient electrode-pixels with local front-ends facilitate the creation of arrays with market-leading electrode density.
Target Audience
Corticale's primary customers include neuroscientists, medical research companies, and neurotech industries focused on advancing neuroprosthetics and therapies for brain and mental disorders.
Features
- CMOS-based neural probes with up to 1024 independent recording electrodes
- Electrode spacing of 30 micrometers for high-resolution data acquisition
- Minimally invasive design for long-term stability
- Ultra-high-density (UHD) sensor arrays for high-definition readout
- Modular technology for multi-probe implantation across broad brain areas
- Energy-efficient CMOS technology with low thermal dissipation for enhanced biocompatibility
- Scalable modular architecture enabling tailored solutions for diverse applications