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Corephotonics

Corephotonics provides multi‑aperture camera technology for smartphones, combining compact dual‑camera and folded lens modules, micro‑electromechanical actuators, and AI‑driven computational photography. Their end‑to‑end platform—hardware, firmware, and software—enables high‑resolution optical zoom, optical image stabilization, and depth‑aware imaging within thin device form factors, targeting mobile OEMs seeking premium camera performance.

Tel - Aviv, IsraelFounded 20126710K+ followers
Updated 2 months ago

Funding

Funding not disclosed

4OMV
Funding rounds are not available yet.

Founders

Product

Problem

Smartphone cameras face physical size constraints that limit optical zoom, image stabilization, and sensor size, resulting in compromised image quality and limited photographic capabilities for end users.

Solution

Corephotonics develops and licenses multi‑aperture camera technologies that combine compact lens designs, micro‑electromechanical actuators, and advanced computational photography algorithms. By integrating dual‑camera zoom modules, folded (periscope) optics, and AI‑driven image processing, the company enables high‑resolution optical zoom, optical image stabilization, and depth‑aware imaging within the thin form factor of modern smartphones. Their end‑to‑end platform includes hardware, firmware, and software components that can be incorporated into mobile devices, allowing manufacturers to deliver superior image quality without increasing device thickness.

Target Audience

Primary customers are mobile device manufacturers and OEMs seeking to enhance camera performance in flagship and premium smartphones.

Features

  • Compact dual‑camera and folded telephoto lens modules delivering up to 5× optical zoom in a smartphone‑compatible form factor
  • Micro‑electromechanical systems for fast autofocus, optical image stabilization, and dynamic aperture control
  • Integrated computational photography pipeline with real‑time image fusion, depth mapping, and AI‑based scene understanding
  • Heterogeneous computing architecture supporting CPU, GPU, DSP, and unified memory for efficient on‑device processing
  • Full in‑house testing, environmental reliability validation, and high‑volume manufacturing readiness
  • Extensive patent portfolio (300+ granted, 200+ pending) covering optics, mechanics, and imaging algorithms
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