ClassOne Technology provides advanced wet processing platforms for microelectronics fabrication, specializing in electroplating and surface preparation. Their Solstice single-wafer and Trident batch systems deliver precise metallization and conditioning for semiconductor manufacturing, enabling high uniformity and cost-efficiency.
Funding
Funding not disclosed
Founders
Product
Problem
Manufacturers of advanced microelectronics face challenges in achieving precise and uniform deposition of metallic layers and in preparing surfaces for subsequent processing steps. Traditional methods can lead to inconsistencies, defects, and limitations in feature resolution, impacting device performance and yield.
Solution
ClassOne Technology provides advanced wet processing platforms designed for electroplating and surface preparation in microelectronics fabrication. Their Solstice single-wafer and Trident batch systems offer tailored solutions for complex metallization and surface conditioning requirements. These systems are engineered to deliver high uniformity, repeatability, and cost-efficiency, supporting both high-volume manufacturing and research and development initiatives. By focusing on process control and system flexibility, ClassOne enables manufacturers to achieve superior results in critical fabrication steps.
Target Audience
ClassOne Technology serves semiconductor and compound semiconductor manufacturers, including those in advanced packaging, MEMS, sensors, RF, power devices, and display markets, as well as research institutions and universities.
Features
- **Solstice Single-Wafer Platform:** A modular and configurable system supporting a wide range of electroplating and surface preparation applications on a single platform.
- **Solstice GoldPro:** Optimized for fine-feature gold fill, Through-Wafer Via (TWV) plating, and through-mask gold plating with high uniformity and plating rates.
- **Solstice CopperMax:** Utilizes a cationic exchange membrane for uniform copper plating, including copper pillar, TSV, TWV, RDL, and damascene fill applications.
- **Solstice Packaging:** Designed for advanced packaging techniques, supporting nickel plating, copper pillar, solder bump, and alloy deposition.
- **Solstice Wet Etch:** Offers high-performance wet etching with face-down processing, end-point detection, and support for UBM etch, patterned metal etch, and TSV cleans.
- **Solstice Metal Lift-Off (MLO) & Photoresist Strip:** Provides automated solvent processing for effective resist removal and MLO applications with a face-down architecture to prevent redeposition.
- **Solstice Anodization:** Enables precision formation of anodized films, including ultra-high-aspect-ratio pores, with tight control over pore spacing and diameter.
- **Trident Batch Processing Platform:** Offers affordable and configurable wet process solutions.
- **Trident Spray Solvent Tool (SST):** Delivers efficient cascade of solvent or rinse water for enhanced process performance and reduced chemical consumption.
- **Trident Spin Rinse Dryer (SRD):** Provides precise flow and pressure control for optimal drying performance.
- **Windows-based Solaris Controller:** Intuitive control system for both engineers and operators, supporting data logging and GEM/SECSII communications.
- **Substrate Versatility:** Capable of processing various substrate materials including silicon, GaN, GaAs, SiC, InP, glass, and sapphire, across a range of wafer sizes from 75mm to 200mm.