Chiplet.US offers a full‑stack design‑for‑manufacturability and integration service for chiplet‑based 2.5D/3D‑IC architectures, covering AI‑accelerated DFM analysis, RTL‑to‑GDSII implementation, SI/PI simulation, and advanced packaging trade studies. The cloud‑based workflow provides early risk metrics, yield forecasts, and compliance documentation, enabling semiconductor firms and system integrators to reduce NRE, shorten development cycles, and improve first‑pass assembly yield.
Funding
Funding not disclosed
Founders
Product
Problem
Organizations adopting chiplet and 3D‑IC architectures often discover packaging constraints, manufacturability risks, and yield issues only after the architecture is fixed, leading to costly respins, delayed time‑to‑market, and inflated NRE.
Solution
Chiplet.US delivers a full‑stack design and integration service that couples chiplet system architecture, design‑for‑manufacturability (DFM) analysis, RTL‑to‑GDSII implementation, and advanced 2.5D/3D‑IC packaging under a single workflow. AI‑assisted tools accelerate DFM checks, warpage prediction, and yield modeling, providing quantitative risk metrics early in the concept phase. A stage‑gated process aligns die partitioning, thermal and mechanical co‑design, and signal‑integrity (SI/PI) simulations with package constraints before mask tape‑out. The service includes UCIe and custom die‑to‑die (D2D) interface audits, STCO test‑vehicle design, and qualification‑ready documentation for traceability. Cloud‑based analytics generate yield forecasts and design trade‑off reports that feed directly into client decision‑making. By treating the package as a first‑order system constraint, Chiplet.US reduces NRE, shortens development cycles, and improves first‑pass assembly yield.
Target Audience
Primary customers are semiconductor companies and fabless design houses developing chiplet‑based processors, as well as hyperscalers, automotive OEMs, defense primes, telecom equipment manufacturers, AI/ML accelerator developers, and medical edge‑AI firms that require integrated architecture, DFM, and advanced packaging expertise.
Features
- AI‑accelerated DFM workflow covering micro‑bump pitch, redistribution layer routing, thermal, warpage, and assembly‑yield modeling for 2.5D and 3D‑IC programs
- End‑to‑end RTL‑to‑GDSII chiplet implementation with mixed‑signal floorplanning and die‑to‑die PHY integration
- UCIe and custom D2D interface selection, interoperability audits, and package‑channel trade studies
- STCO (silicon‑test‑chip‑on) test‑vehicle design, fabrication planning, and electrical characterization to de‑risk stack and package assumptions before production
- Full‑stack SI/PI simulation suite for high‑speed SerDes, memory interfaces, and power‑delivery network (PDN) analysis
- Thermal‑mechanical co‑design tools that predict junction‑to‑ambient temperature and package warpage across automotive, aerospace, and edge‑AI operating envelopes
- Cloud‑hosted analytics platform delivering yield forecasts, cost/NRE framing, and automated compliance reports (e.g., ISO 26262, AEC‑Q100)
- Vendor‑agnostic packaging strategy supporting foundry and OSAT options, with documentation for traceability and mixed‑criticality programs