CelLink provides large‑format, high‑conductance flexible circuits that replace traditional round‑wire harnesses and rigid busbars in electric‑vehicle battery packs, automotive systems, and high‑power data‑center modules. Their Current Collector Assembly+ (CCA+) platform integrates power bussing, voltage and temperature monitoring, and fusing into a thin, bendable substrate, delivering up to thousands of amps while reducing weight to about 25% and volume to 10% of conventional solutions.
Funding
$362M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
UDFounders
Product
Problem
Conventional round-wire harnesses and rigid busbars used in electric vehicles, battery packs, and high‑power data‑center equipment are heavy, bulky, and limited in current‑carrying capacity, making system integration inefficient and increasing vehicle weight and infrastructure footprint.
Solution
CelLink supplies large‑format, high‑conductance flexible circuits that replace traditional wiring with lightweight, space‑saving flex harnesses. Their Current Collector Assembly+ (CCA+) platform integrates power bussing, cabling, voltage and temperature monitoring, and fusing into a single flexible substrate. By delivering up to thousands of amps in a thin, bendable form factor, the technology reduces weight to one‑quarter and volume to one‑tenth of comparable round‑wire solutions. The circuits meet or exceed industry standards for both low‑voltage and high‑voltage applications, enabling more efficient power distribution in electric‑vehicle battery packs, automotive systems, and data‑center power modules. This integration simplifies assembly, improves reliability, and supports the broader shift toward electrified transportation and high‑density computing infrastructure.
Target Audience
Primary customers are electric‑vehicle manufacturers, battery‑pack suppliers, automotive OEMs, and data‑center power‑distribution designers seeking lightweight, high‑current interconnect solutions.
Features
- High‑conductance flexible substrates that carry thousands of amps while remaining thin and bendable
- Integrated power bussing, voltage sensing, temperature monitoring, and fusing within a single flex circuit (CCA+ platform)
- Weight reduction to ~25% and volume reduction to ~10% compared with traditional round‑wire harnesses
- Compliance with low‑voltage and high‑voltage industry standards for automotive, battery, and data‑center applications
- Customizable layout and routing to fit complex vehicle and rack designs, reducing assembly time and part count
- Scalable manufacturing for large‑format circuits used in battery pack interconnects and high‑power data‑center modules