Carbice develops advanced thermal interface materials designed to improve heat dissipation in high-performance electronics. Their solutions address common failure points related to thermal cycling and material degradation in demanding applications like data centers and aerospace. This technology enables higher cooling capacity and increased reliability for power-dense computing systems.
Funding
Funding not disclosed
Founders
Product
Problem
Electronic systems face challenges related to overheating, which can lead to decreased performance, shorter lifespans, and increased cooling requirements. Traditional thermal interface materials (TIMs) may not provide the necessary reliability and predictability for effective heat dissipation in demanding applications.
Solution
Carbice Corporation develops thermal interface materials using vertically-aligned carbon nanotubes to address heat dissipation challenges in electronic systems. Carbice pads offer predictable thermal performance by eliminating mechanical failure modes at the interface, resulting in more resilient and sustainable systems. Their materials science approach enables engineers to solve structural, contact, and energy transport physics of any interface size or customer design. This allows for accurate prediction of system performance during development, leading to optimized designs and faster validation.
Target Audience
The primary customers are engineers and designers in the aerospace, defense, automotive, consumer electronics, data center, and semiconductor industries who require reliable thermal management solutions for electronic systems.
Features
- Vertically-aligned carbon nanotube (CNT) structure for enhanced thermal conductivity
- Always-elastic CNTs eliminate mechanical failure at interfaces
- Proprietary data-enabled software (Carbice SIM) for digital design and development
- High-fidelity system data enables accurate prediction of system performance
- Flight heritage with TRL 9 qualification for aerospace and defense applications
- Available as Ice Pad™ for general applications and Space Pad™ for orbital environments
- Solutions for various markets including space power modules, data centers, lasers, consumer electronics, and semiconductor testing