Boston Materials provides a drop‑in thermal interface material, Liquid Metal ZRT®, that combines a carbon‑fiber scaffold with a liquid‑metal filler to deliver anisotropic heat conduction for high‑power GPUs and ASICs. The TIM reduces device junction temperatures by 5–8 °C on 1 kW+ workloads, enabling higher power limits and lower cooling energy, and is compatible with existing server and liquid‑cooling designs.
Funding
$13.5M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
DEFounders
Product
Problem
High-performance data center GPUs and other kilowatt-scale compute devices generate large heat loads, but conventional thermal interface materials (TIMs) cannot dissipate enough heat, leading to elevated operating temperatures, reduced power envelopes, and lower overall energy efficiency.
Solution
Boston Materials supplies a proprietary Z‑axis carbon‑fiber and liquid‑metal composite TIM, marketed as Liquid Metal ZRT®, that can be installed as a drop‑in replacement for existing interfaces. The material’s engineered anisotropic thermal conductivity delivers a measured 5–8 °C reduction in device temperature for 1 kW+ workloads. By lowering junction temperatures, the TIM enables higher processor power limits, reduces cooling‑system energy draw, and improves rack‑level Power Usage Effectiveness (PUE). The solution is validated on previous‑generation NVIDIA data‑center GPUs and on test rigs emulating upcoming architectures, ensuring compatibility with current server designs without redesign.
Target Audience
Primary customers are data‑center operators, rack‑scale system integrators, and thermal or silicon design engineers developing high‑power GPUs, ASICs, and server platforms.
Features
- Z‑axis carbon‑fiber scaffold combined with a high‑conductivity liquid‑metal filler for directional heat flow
- Drop‑in form factor that fits standard GPU and ASIC mounting footprints, requiring no mechanical redesign
- Demonstrated 5–8 °C device‑level temperature reduction on 1 kW+ devices under real‑world load conditions
- Proven thermal performance on NVIDIA data‑center GPUs and Blackwell‑class test vehicles
- Engineered for stability under high current density and continuous operation, with low thermal resistance and minimal pump‑down time
- Compatibility with existing liquid‑cooling loops and rack‑scale cooling architectures
- Material data sheets and integration guidelines provided for thermal and silicon design teams