The company delivers end‑to‑end photonic engineering, converting customer specifications into custom low‑loss waveguides, fiber‑optic couplers, and integrated photonic modules using precision glass molding and silicon‑photonic lithography. It provides rapid prototyping (under 4 weeks) and low‑volume production with in‑house metrology and compliance to IEC 61754, Telcordia, and MIL‑STD‑810 for telecom, LiDAR, and industrial laser OEMs.
Funding
Funding not disclosed
Founders
Product
Problem
Customers in telecommunications, sensing, and industrial laser markets require high‑performance optical components that meet tight specifications for loss, bandwidth, and environmental stability, yet traditional suppliers often have long lead times and limited design flexibility.
Solution
The company offers a full‑stack photonics engineering service that takes customer specifications from concept through to manufactured optical components and subsystems. Using precision glass molding, silicon‑photonic lithography, and automated assembly, it delivers low‑loss waveguides, fiber‑optic couplers, and integrated photonic modules with rapid turnaround. Design engineers work directly with clients to optimize geometry, material selection, and packaging for the target wavelength range, reducing iteration cycles. Production is supported by in‑house metrology and quality‑control processes that ensure compliance with industry standards such as IEC 61754 and Telcordia. The resulting components can be shipped in low‑volume batches or scaled to larger volumes as demand grows.
Target Audience
Primary customers are OEMs and system integrators in telecom infrastructure, LiDAR sensing, and industrial laser equipment who need bespoke optical components and short‑lead‑time delivery.
Features
- Custom waveguide and grating designs generated with electromagnetic simulation tools (FDTD, FEM) for wavelengths from 850 nm to 1550 nm
- Precision glass molding and silicon‑photonic wafer processing delivering insertion loss < 0.3 dB per connector
- Automated fiber‑to‑chip alignment with sub‑micron tolerance and epoxy‑free packaging options
- In‑house optical testing suite (OTDR, spectral analysis, environmental stress screening) for full‑traceability certification
- API‑driven order management platform that provides real‑time status updates and design file exchange (GDSII, Lumerical)
- Compliance with IEC 61754, Telcordia, and MIL‑STD‑810 for aerospace and defense applications
- Low‑volume production capability (≤ 10 units) with rapid prototyping cycles under 4 weeks