Besi offers advanced semiconductor assembly equipment for high-volume, high-precision manufacturing. Their solutions support leadframe, substrate, and wafer-level packaging, enabling increased throughput and cost-effectiveness for complex semiconductor devices.
Funding
Funding not disclosed
Founders
Product
Problem
The semiconductor industry faces challenges in achieving high-volume, high-precision assembly for advanced packaging applications. Traditional methods can be limited in throughput, accuracy, and flexibility, impacting the efficiency and cost-effectiveness of producing complex semiconductor devices.
Solution
Besi provides advanced semiconductor assembly equipment designed to address these challenges across various packaging technologies. Their solutions cater to leadframe, substrate, and wafer-level packaging, enabling manufacturers to achieve higher precision, increased throughput, and improved cost of ownership. By focusing on technological leadership and system reliability, Besi supports the production of semiconductors for diverse end-user markets, including mobile, automotive, computing, and emerging technologies like AI and big data.
Target Audience
Primary customers include leading semiconductor manufacturers, outsourced semiconductor assembly and test (OSAT) providers, and electronics and industrial companies requiring advanced semiconductor packaging solutions.
Features
- Equipment for leadframe assembly, including die attach and wire bonding processes.
- Substrate assembly solutions supporting multi-layer substrates and flip-chip die bonding.
- Wafer-level packaging equipment designed for advanced miniaturization and performance.
- High-speed flip-chip bonders with advanced vision systems and dual gantry configurations for increased throughput.
- Multi-module attach platforms offering high accuracy and flexibility for various die sizes and packaging types.
- Molding equipment for single-sided packaging with features like Top Foil for bleed-free bare die production.
- Plating and cleaning equipment for leadframe wet processing, plating, and flux cleaning.
- Selective plating equipment for connector plating applications.
- Direct plating lines for solar cell metallization, enabling efficiency increases and cost reductions.
- Comprehensive after-sales support including spares, tooling, and customer service.