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Beneq

Beneq offers Atomic Layer Deposition (ALD) equipment for precise nanoscale material deposition. Their systems enable the fabrication of high-quality, conformal thin films with atomic-level control, essential for semiconductor manufacturing and advanced coatings.

Espoo, FinlandFounded 20051707K+ followers
Updated 3 months ago

Funding

$32.8M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.

R
Funding rounds are not available yet.

Founders

Product

Problem

Achieving precise nanoscale material deposition for advanced electronic components and industrial coatings is challenging with conventional methods. The need for highly conformal, dense, and defect-free films with atomic-level control requires specialized equipment.

Solution

Beneq provides Atomic Layer Deposition (ALD) equipment designed for precise nanoscale material manipulation. Their systems enable the fabrication of high-quality thin films with exceptional conformality and thickness control, crucial for semiconductor manufacturing, batch production, and flexible substrate coating. Beneq's ALD solutions are engineered to meet the stringent requirements of advanced interfacial engineering and device optimization across various industries. The company also offers development and coating services to facilitate customer adoption and accelerate time-to-market for new ALD applications.

Target Audience

Beneq serves manufacturers and researchers in the semiconductor industry, advanced electronics, optics, photonics, energy storage, and other sectors requiring high-precision thin film deposition.

Features

  • Industrial and research-grade Atomic Layer Deposition (ALD) equipment.
  • Solutions tailored for semiconductor fabrication, batch production, and flexible substrate coating.
  • Systems designed for high aspect ratio structures, ensuring conformal film deposition.
  • Capability for precise, nanometer-level control of film thickness.
  • Support for various ALD modes including Thermal ALD, Plasma-Enhanced ALD (PE-ALD), and Spatial ALD.
  • Equipment designed for material versatility and process scalability.
  • Specialized ALD tools for applications such as advanced packaging, MEMS, sensors, power devices, and optical coatings.
  • Roll-to-roll ALD systems for continuous processing of flexible substrates.
  • Cluster-compatible spatial ALD equipment for high-volume manufacturing.
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