BeamShape offers high‑power electron beam 3D printers designed for demanding aerospace, medical, and energy applications. Leveraging expertise from advanced electron microscope design, the system uses vacuum‑based electron beam melting to selectively fuse metal powder layer by layer, enabling the production of complex, high‑strength parts.
Funding
Funding not disclosed
Founders
Product
Problem
Manufacturing high‑strength, complex metal parts for aerospace, medical implants, and energy systems often requires large, expensive equipment and multiple processing steps, limiting part geometry, material performance, and production scalability.
Solution
BeamShape delivers high‑power electron beam melting (EBM) 3D printers that fuse metal powder in a vacuum using a focused electron beam. The vacuum environment and electron beam enable rapid, deep melt pools and superior material properties compared to laser‑based systems, allowing the production of dense, high‑strength components with intricate internal features. The printers are built on expertise from advanced electron microscope design, ensuring precise beam control and reliable operation for demanding industrial workloads. BeamShape also offers custom electron‑beam system development for semiconductor and life‑science partners, extending additive‑manufacturing capabilities to specialized processes.
Target Audience
Primary customers are manufacturers of aerospace components, medical implant producers, and energy‑sector firms requiring high‑performance metal parts, as well as semiconductor and life‑science companies seeking bespoke electron‑beam additive‑manufacturing solutions.
Features
- Very high‑power electron beam source operating in high vacuum for deep, uniform melt zones
- Automated powder feeding and layer deposition system for continuous build cycles
- Real‑time beam monitoring and adaptive control derived from electron‑microscope technology
- Capability to process a wide range of aerospace‑grade alloys, medical‑grade titanium, and high‑temperature energy materials
- Modular design that supports custom electron‑beam configurations for semiconductor and life‑science applications
- Integrated software for build planning, process monitoring, and post‑process inspection data management