Advanced Systems Automation designs and manufactures automated backend equipment for semiconductor assembly, including UV tape curing, encapsulation, and wafer processing systems. Their solutions optimize high-throughput production lines for semiconductor manufacturers.
Funding
Funding not disclosed
Founders
Product
Problem
Semiconductor assembly processes require specialized automated equipment for critical steps such as tape curing, encapsulation, wafer processing, and strip mounting. Manufacturers face challenges in sourcing reliable, high-throughput machinery that meets stringent quality and precision requirements for these backend operations.
Solution
Advanced Systems Automation Limited (ASA) designs and manufactures automated backend equipment for the semiconductor assembly industry. ASA provides a comprehensive suite of solutions, including UV tape curing, encapsulation, wafer processing, and strip mounting technologies. The company's equipment is engineered for high throughput and precision, supporting global semiconductor manufacturers in optimizing their production lines. Beyond equipment manufacturing, ASA also offers Equipment Contract Manufacturing Services (ECMS) for electromechanical components in the semiconductor, healthcare, and scientific industries.
Target Audience
The primary customers are semiconductor manufacturers and assembly houses requiring automated backend processing equipment. The ECMS division also serves clients in the healthcare and scientific industries needing precision electromechanical component manufacturing.
Features
- **UV Tape Curing Systems:** Fully automatic systems (e.g., A2108, A2112) utilizing high-speed flash UV irradiation for UV tape curing without requiring nitrogen gas or clean gas filters, offering longer lamp lifespan and higher throughput.
- **Encapsulation Systems:** Automolding systems (e.g., E120 Series) designed for semiconductor encapsulation, featuring front access presses with independent control, suitable for Ball Grid Array (BGA) and Quad Flat No-leads (QFN) packages, with clamp forces up to 120 tons.
- **Wafer Processing Equipment:** Semi-automatic and fully automatic vacuum mounting systems (e.g., A9108vs, A9112, A9308vf) for wafer back-up to metal film frame mounting, featuring non-contact mounting processes and support for various wafer sizes and thicknesses. Includes ultrasonic contactless wafer cleaning systems (e.g., A3106).
- **Strip Mounting and Detaping Equipment:** Fully automatic detapers (e.g., A8108) for separating kapton tape from substrates without manual handling, and semi-automatic roller mounters (e.g., A9108rs) for mounting Mylar tape onto LED substrates or silicon wafers.
- **Equipment Contract Manufacturing Services (ECMS):** Manufacturing of electromechanical components and parts for the semiconductor, healthcare, and scientific industries.
- **User Interface:** Electronic color touch screens with self-diagnostic and error code display for intuitive operation and process monitoring.
- **Automation:** PLC-based control and robotic transfer mechanisms for high throughput and reduced handling times.