Funding
Funding not disclosed
Founders
Product
Problem
Current high‑performance computing systems rely on electrical interconnects that consume significant power and occupy large silicon area, limiting the scalability of AI data‑center racks, chiplet‑scale fabrics, and fiber‑based links. The lack of energy‑efficient photonic components hampers the ability to transmit and process massive AI model parameters cost‑effectively.
Solution
Artilux provides a portfolio of energy‑efficient photonic components designed to enable high‑speed optical interconnects across AI data‑center racks, chiplet fabrics, and fiber links. Its GeSi electro‑absorption modulators (EAMs) operate in the O‑band and are paired with ultra‑low‑loss 2D vertical grating coupler arrays to deliver narrow‑band, high‑bandwidth waveguide links. Large‑scale GeSi detector arrays integrated with 2D metasurface optics on a 12‑inch CMOS platform offer ultra‑low‑power optical I/O for scalable chiplet communication. Additionally, Artilux’s photonic computing architectures achieve unprecedented power and area efficiency, supporting the processing of trillions of AI model parameters. Together, these technologies reduce power and silicon footprint while scaling data‑sensing, transfer, and processing capabilities.
Target Audience
Primary customers are AI data‑center operators, semiconductor manufacturers, and system integrators developing chiplet‑based AI accelerators and high‑performance optical interconnect solutions.
Features
- GeSi multiple electro‑absorption modulators (EAMs) operating in the O‑band for narrow‑band, high‑speed optical links
- Ultra‑low‑loss 2D vertical grating coupler arrays enabling efficient waveguide‑based interconnects
- Large‑scale GeSi detector arrays with integrated 2D metasurface optics on a 12‑inch CMOS platform for ultra‑low‑power optical I/O
- Photonic computing architecture optimized for power and area efficiency, capable of handling trillions of AI parameters
- Scalable chiplet‑scale optical fabrics supporting high‑density inter‑chip communication
- Fiber‑compatible optical interfaces linking cloud, edge, and consumer systems