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Arque

Arque Systems builds silicon quantum processors that use electron‑spin qubits fabricated with standard CMOS technology, delivering qubit densities orders of magnitude higher than superconducting or trapped‑ion devices. Integrated on‑chip cryogenic control electronics provide per‑qubit addressability and low‑latency operation, enabling fault‑tolerant, large‑scale quantum computing for research labs and cloud providers.

Updated 2 months ago

Funding

Funding not disclosed

Funding rounds are not available yet.

Founders

Founder details are not available yet.

Product

Problem

Current quantum computing hardware struggles to scale beyond a few hundred qubits due to limited qubit density, high interconnect overhead, and reliance on specialized fabrication processes, which hampers the ability to tackle real‑world problems that require fault‑tolerant, large‑scale quantum processors.

Solution

Arque Systems delivers a silicon‑based quantum processor that encodes information in electron spins within a standard CMOS substrate. Their patented qubit architecture provides orders‑of‑magnitude higher qubit density while preserving high coherence and fast gate operations. By integrating on‑chip cryogenic control electronics, the platform reduces wiring complexity and enables independent, low‑latency control of each qubit. Leveraging mature semiconductor manufacturing lines, the solution offers a cost‑effective path to millions of qubits, positioning it for fault‑tolerant quantum advantage on computational chemistry, materials science, and cryptography workloads.

Target Audience

Primary customers are quantum research institutions, enterprise R&D labs, and cloud quantum service providers that require high‑density, fault‑tolerant processors for large‑scale simulations and algorithm development.

Features

  • Electron‑spin qubits fabricated in silicon using industry‑standard CMOS processes, ensuring compatibility with existing fab infrastructure.
  • Patented scalable architecture that achieves 10³–10⁵× higher qubit density per die compared with superconducting or trapped‑ion platforms.
  • Integrated on‑chip cryogenic control electronics for per‑qubit addressability, reducing cryostat wiring and latency.
  • High‑fidelity single‑ and two‑qubit gates with operation speeds in the sub‑nanosecond regime and error rates compatible with surface‑code error correction.
  • Robust inter‑qubit connectivity topology that supports both nearest‑neighbor and long‑range coupling without sacrificing layout density.
  • Fault‑tolerant design methodology that incorporates built‑in error‑mitigation protocols and real‑time calibration loops.
  • End‑to‑end software stack with hardware abstraction layer, enabling seamless integration with quantum programming frameworks and cloud orchestration services.
This profile is AI-generated and may contain inaccuracies.