Arieca manufactures Liquid Metal Embedded Elastomers (LMEE), a thermally conductive rubber composite designed for high-performance thermal interface materials in the semiconductor industry. This technology addresses the challenge of managing increased power densities by providing low thermal resistance and reliability in high-volume manufacturing processes.
Funding
$8.2M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
NCFounders
Product
Problem
As power densities in semiconductors increase, effective thermal management becomes more challenging, requiring materials that offer both low thermal resistance and high reliability in high-volume manufacturing. Traditional thermal interface materials often struggle to meet these demands, leading to potential performance bottlenecks and reduced product lifespan.
Solution
Arieca provides Liquid Metal Embedded Elastomers (LMEE), branded as TIMbber™, which are thermally conductive rubber composites designed to address the increasing thermal management challenges in the semiconductor industry. These materials combine the high thermal conductivity of liquid metals with the mechanical properties of soft polymers, ensuring both efficient heat dissipation and robust reliability. Arieca's LMEE technology is engineered for compatibility with standard high-volume manufacturing processes, offering a practical solution for advanced packaging and thermal management. The composite structure reliably contains liquid metal within a protective elastomer matrix, tailoring material properties for specific applications and maintaining performance under high deformation.
Target Audience
Arieca's primary customers are semiconductor manufacturers and thermal engineers in industries such as high-performance computing, electric vehicles, and consumer electronics, who require advanced thermal management solutions for their devices.
Features
- Composite material combining liquid metal alloy droplets with soft polymers
- High thermal conductivity for efficient heat dissipation
- Mechanical robustness and flexibility from the elastomer matrix
- TIMbber™ formulations engineered for semiconductor cooling and heat dissipation
- Metal-like fracture toughness (10-30 kJ/m2), significantly greater than conventional silicone rubber
- Maintains performance under high deformation and mechanical damage
- Compatible with standard high-volume manufacturing techniques
- Available in different formulations (TIM 1, TIM 1.5, TIM 2) optimized for SiC power modules, high-performance computing, and consumer electronics, respectively