Arctic Sensing provides the ARC10, a fully integrated ultra‑wideband radar transceiver and backend on a single silicon die. The chip combines low‑frequency operation, multi‑GHz bandwidth and an 8 GS/s ADC to deliver deep penetration, sub‑centimeter range resolution, and high dynamic range, while its on‑chip synchronization enables unlimited beamforming arrays. This compact solution reduces system complexity for OEMs and integrators building ground‑penetrating radar, structural‑inspection, vital‑sign monitoring, and 2D/3D imaging systems.
Funding
Funding not disclosed
Founders
Product
Problem
Many applications that require ground‑penetrating radar, material inspection, or non‑contact vital‑sign monitoring need ultra‑wideband (UWB) transceivers with high dynamic range, fine range resolution, and the ability to scale into large beamforming arrays. Existing solutions are often built from multiple discrete components, limiting performance, increasing size, and complicating system integration.
Solution
Arctic Sensing offers the ARC10, a fully integrated UWB radar transceiver and backend on a single silicon die. The chip’s low center frequency and multi‑GHz bandwidth enable deep penetration and sub‑centimeter range resolution, while an 8 GS/s sampling engine delivers high‑fidelity signal capture. A novel on‑chip synchronization architecture allows designers to combine many ARC10 devices into arbitrarily large beamforming arrays without external timing hardware. By providing a complete analog/RFIC solution in a compact form factor, the platform reduces board‑level complexity and accelerates development of GPR, structural‑inspection, vital‑sign, and 2D/3D imaging systems.
Target Audience
Primary customers are OEMs, system integrators, and research teams developing ground‑penetrating radar, structural‑health monitoring, livestock vital‑sign monitoring, and advanced imaging solutions that require high‑performance UWB sensing.
Features
- Integrated UWB transmitter, receiver, and high‑speed 8 GS/s ADC on a single chip
- Low center‑frequency operation optimized for deep ground and material penetration
- Wide multi‑GHz bandwidth delivering high dynamic range, SNR, and sub‑cm range resolution
- On‑chip synchronization scheme enabling scalable beamforming arrays of unlimited size
- Built‑in calibration and test circuits for rapid system bring‑up and reliable performance
- Designed for both stationary and moving platforms, supporting 2D/3D imaging applications