Analog Quantum Circuits designs and fabricates superconducting analog microwave components—such as on‑chip circulators, amplifiers, and attenuators—optimized for cryogenic quantum processors.
Funding
$1.9M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Scaling solid-state quantum computers requires high-performance analog microwave components—such as amplifiers, attenuators, and circulators—that operate with low loss and high coherence at cryogenic temperatures. Existing commercial parts are often bulky, off-chip, and not optimized for integration, limiting the ability to build large‑scale quantum processors.
Solution
Analog Quantum Circuits (AQC) designs and fabricates superconducting analog components that can be integrated directly on quantum chips. By leveraging a decade of theoretical and experimental research, AQC produces passive on‑chip superconducting circulators and related microwave devices that provide low‑loss, non‑reciprocal signal routing without the need for external magnetic bias. Their fabrication processes enable compact, high‑coherence components that can be co‑located with qubits, reducing parasitic losses and simplifying system architecture. The resulting hardware supports more reliable control and readout of quantum bits, facilitating the scaling of solid‑state quantum processors.
Target Audience
Primary customers are quantum hardware manufacturers and research labs developing solid‑state quantum processors that require integrated, high‑coherence microwave components for qubit control and readout.
Features
- Passive on‑chip superconducting circulator based on a ring of Josephson tunnel junctions, demonstrated with dc‑only control fields
- Fabrication workflow optimized for integrating microwave components directly onto quantum processor chips
- Low‑loss, non‑reciprocal signal routing without magnetic materials, preserving qubit coherence
- Compatibility with standard cryogenic microwave packaging and interconnect standards
- Proven performance documented in peer‑reviewed publications (PRL 2023, PRR 2021, etc.)