American Integrated Circuits (AIC) mass‑produces high‑purity silicon and silicon carbide in the United States using a proprietary refinement process that achieves up to 11 N purity and feature sizes down to 2.5 µm. By integrating the full value chain—from metallurgical silicon to wafers—the company reduces material waste, cuts manufacturing costs by over 23×, and provides faster, secure supply to domestic semiconductor fabs and power‑electronics manufacturers.
Funding
Funding not disclosed
Founders
Product
Problem
U.S. semiconductor manufacturers face supply‑chain constraints and high costs because most high‑purity silicon and silicon carbide are sourced from overseas facilities. Limited domestic production capacity hampers rapid scaling and increases exposure to geopolitical risk.
Solution
American Integrated Circuits (AIC) addresses this gap by mass‑producing silicon commodities—including metallurgical silicon, mono‑silicon, wafers, and silicon carbide—within a fully integrated U.S. manufacturing line. The company leverages a proprietary refinement method that achieves ultra‑high purity levels up to 99.999999999 % (11 N) while dramatically cutting material waste. By controlling the entire value chain, AIC can deliver high‑purity silicon faster and at a lower cost than traditional offshore suppliers. The process also enables tighter feature size control, targeting 2.5 µm dimensions, which supports advanced micro‑chip designs. Customers receive a domestic, secure source of silicon that aligns with national‑security requirements and growing commercial demand for high‑performance power devices.
Target Audience
Primary customers are U.S.-based semiconductor fabs, power‑electronics manufacturers, and silicon wafer suppliers that require high‑purity silicon or silicon carbide for advanced device fabrication.
Features
- Proprietary high‑purity refinement technology delivering up to 11 N silicon and silicon carbide<br/>
- Full‑stack manufacturing of metallurgical silicon, mono‑silicon, silicon rods, wafers, tetrachloride, graphite, and SiC<br/>
- Cost‑reduction architecture achieving >23× lower standard manufacturing expenses and 4× higher product yield<br/>
- Capability to produce silicon with feature sizes down to 2.5 µm, surpassing typical industry tolerances (20‑23 µm)<br/>
- Domestic production footprint ensuring rapid delivery and compliance with U.S. national‑security standards<br/>
- Scalable commodity output designed for high‑volume semiconductor fab requirements<br/>
- Integrated waste‑minimization processes that improve sustainability and lower total cost of ownership