AlixLabs specializes in Atomic Layer Etch (ALE) Pitch Splitting technology, enabling the fabrication of nanostructures with dimensions smaller than 20 nanometers on 200 millimeter and 300 millimeter silicon wafers. This process addresses the semiconductor industry's need for cost-effective and energy-efficient manufacturing methods as it transitions to the ångström era.
Funding
$3.6M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
As the semiconductor industry advances into the ångström era, manufacturing nanostructures with sub-20 nanometer dimensions on silicon wafers requires cost-effective and energy-efficient methods that overcome the limitations of traditional lithography techniques. Existing solutions like multi-patterning and extreme ultraviolet (EUV) lithography can be prohibitively expensive and complex.
Solution
AlixLabs addresses these challenges with its Atomic Layer Etch (ALE) Pitch Splitting (APS™) technology, enabling the fabrication of high-resolution nanostructures on 200mm and 300mm wafers. APS™ allows semiconductor manufacturers to create features with critical dimensions of 10nm and half-pitch lines of 20nm. This technology reduces the cost per mask layer by up to 40% compared to EUV lithography and self-aligned quadruple patterning (SAQP). The APS™ process enhances electrical performance in power electronics through precision etching and surface cleaning.
Target Audience
AlixLabs' primary customers are semiconductor manufacturers in the logic, memory, and power electronics segments seeking to reduce manufacturing costs and improve energy efficiency in advanced node fabrication.
Features
- Atomic Layer Etch (ALE) Pitch Splitting (APS™) process for creating nanostructures with sub-20nm dimensions.
- Demonstrated capability of achieving 10 nm critical dimensions.
- Proven on 200mm and 300mm wafers of bulk silicon and wide bandgap materials.
- Cost-effective alternative to multi-patterning and EUV lithography.
- Applications in advanced logic, memory, and power electronics manufacturing.
- Equipment and processes for energy-efficient fabrication beyond optical and electron beam lithography resolution limits.