Aerogen Systems
Aerogen Systems provides point-of-use contamination control for semiconductor fabs with its Talos modular purification system, which chemically destroys airborne molecular contaminants rather than trapping them in filters. The system outperforms ultra-high-purity nitrogen purge by 10 to 100 times and includes onboard real-time contamination monitoring. The company is also developing CleanPipe, a sealed transport system designed to eliminate the need for cleanrooms.
- Semiconductor
- Manufacturing / Industry 4.0
- Chemical Technology
- Hardware
Funding
Raised to date
$500KRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Founder details are not available yet.
Product
Problem
In semiconductor fabs, wafers spend critical time waiting, moving, and staging between tools, where parts-per-billion levels of airborne molecular contamination (AMCs) can cause corrosion, hazing, and residue. Conventional control methods focus on particles and airflow but miss contamination in the gaps between process steps, causing yield loss that standard cleanroom environments cannot prevent.
Solution
Aerogen Systems provides point-of-use contamination control with its Talos modular purification system, a reactor that chemically destroys airborne contaminants wherever wafers sit exposed, rather than trapping them in filters. The system outperforms existing approaches including ultra-high-purity nitrogen purge by one to two orders of magnitude, effectively eliminating a major operating expense for fabs. Onboard sensors report contamination levels in real time, turning "clean" into a measurable number on a screen. The company also develops CleanPipe, a complete sealed transport solution with modular adapters that purifies tooling, storage, and transit so wafers never touch outside air from first step to last, potentially eliminating the need for cleanrooms.
Target Audience
Primary customers are semiconductor fabrication facilities and equipment manufacturers seeking to reduce yield loss from airborne molecular contamination during wafer handling, staging, and transport between process steps.
Features
- Modular reactor system that chemically destroys contaminants at the source rather than collecting them in consumable filters
- 10 to 100 times better performance than existing alternatives including UHP N2 purge
- Achieves 7N purity in 16 minutes, measured live by onboard PID sensors
- Onboard real-time contamination monitoring, turning cleanliness into a measurable metric
- CleanPipe sealed transport system with modular adapters for integration into existing semiconductor tooling
- Tool-integrated design currently being piloted inside semiconductor equipment